Sensor Chip Lithographic Integration for CT Detectors
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Solution Overview
Problem
Current sensor chip production methods for computerized tomography detectors are costly due to the need for wafer-bonding and high contact costs, which also result in complex and expensive integration processes.
Innovation Solution
Lithographic integration of radiation detection elements and analog-digital converters on a single side of a crystalline base plate, with a through-contact for electrical connection between the sides, reducing the need for multiple base plates and simplifying the integration process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wafer-bonding method is used to integrate radiation detection elements and analog-digital converters, then integration is achieved, but production costs and material costs increase significantly
Solution Approach 1:
The patent combines the radiation detection element and the analog-digital converter components onto a single crystalline base plate using lithographic integration. This merging eliminates the need for separate wafer-bonding processes and reduces the number of base plates required, thereby lowering both production complexity and material costs while achieving complete integration of detection and conversion functions.
2Adaptability or versatility
If multiple crystalline base plates are used and bonded together, then functional integration is achieved, but production complexity and costs increase
Solution Approach 1:
The patent merges multiple functional components (radiation detection element, analog-digital converter, and associated circuits) onto a single crystalline base plate. This consolidation reduces the number of separate components and bonding interfaces required, simplifying the production process while maintaining complete functional integration across all necessary subsystems.
3Measurement precision
If conventional sensor chip arrangement is used for high resolution, then pixel density increases, but installation space requirements increase
Solution Approach 1:
The patent integrates the analog-digital converter directly onto the same crystalline base plate as the radiation detection element, eliminating the need for separate converter chips and their associated mounting space. This consolidation reduces the overall installation space required while maintaining high pixel density through efficient lateral arrangement of integrated sensor chips.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces material and production costs, enhances the robustness and service life of sensor chips, and optimizes installation space, allowing for more stable operation and efficient digital signal transmission in CT detectors.
Implementation Method 1
an element detecting radiation
Data Source
AI summary
A sensor chip, in particular for computerized tomography detectors, including an analog-digital converter electrically connected to an element detecting radiation. A problem addressed is that of defining a sensor chip which is as cost-efficient and reliable as possible. According to an embodiment of the invention, only one single crystalline base plate is used, on which all required components of the sensor chip are applied. A through-contact between the conductor paths or the contacts of both sides of the base plate is used as applicable in order to connect the components of both sides to each other.