Sensor Chip Micro-Inductor Structure Inverse Magnetostriction
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Solution Overview
Problem
Existing sensor chips face challenges such as poor temperature stability, linearity issues, and high costs, particularly with the piezoresistive, capacitive, and piezoelectric types, and the complexity of integrating magnetic materials with semiconductor or MEMS processes for inverse magnetostrictive sensors.
Innovation Solution
A sensor chip with a micro-inductor structure comprising a supporting structure layer, a micro-inductor layer with an insulating layer and magnetic layers, and a micro-coil layer that deforms in response to external physical quantities, inducing a change in inductance measurable by an inductance measurement circuit, which is easy to manufacture and cost-effective.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If piezoresistive type sensor chip is used, then manufacturing is simple, but temperature stability is poor
Solution Approach 1:
The patent changes the sensing principle from piezoresistive to magnetostrictive effect, utilizing the relationship between stress and magnetic permeability. This parameter change enables temperature stability improvement while maintaining compatibility with semiconductor manufacturing processes through standard magnetic layer deposition and micro-inductor fabrication.
Solution Approach 2:
The patent employs composite structure combining magnetic layers (with magnetostrictive properties) and insulating layers within the micro-inductor assembly. This composite approach integrates the temperature stability of magnetic materials with the manufacturing advantages of standard semiconductor processes.
2Ease of manufacture
If capacitive type sensor chip is used, then manufacturing is simple, but linearity is poor
Solution Approach 1:
The patent transitions from capacitive sensing to magnetostrictive sensing, changing the fundamental measurement parameter from electrical capacitance to magnetic permeability. This parameter change inherently improves linearity because the magnetostrictive effect provides a more linear relationship between applied stress and magnetic property changes.
3Measurement precision
If piezoelectric type sensor chip is used, then sensitivity is high, but cost is high
Solution Approach 1:
The patent replaces expensive piezoelectric materials with cost-effective magnetic layers that can be deposited using standard semiconductor manufacturing techniques. The micro-inductor structure uses conventional conductive materials and insulating layers, eliminating the need for costly piezoelectric crystals or ceramics while maintaining high sensitivity through the magnetostrictive effect.
Solution Approach 2:
The patent changes from piezoelectric effect (charge generation) to magnetostrictive effect (magnetic permeability change), utilizing inductance measurement instead of charge measurement. This parameter change enables the use of cheaper materials and standard manufacturing processes while preserving high sensitivity through the micro-inductor's magnetic field interaction.
4Measurement precision
If inverse magnetostrictive effect is used, then sensitivity and temperature stability are high, but process complexity increases
Solution Approach 1:
The patent merges the magnetic layer deposition with standard semiconductor manufacturing processes, integrating the magnetostrictive sensing function into the existing process flow. The micro-inductor fabrication is combined with magnetic layer deposition and insulating layer formation, eliminating the need for separate, complex process steps and reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro-inductor layer effectively leverages the inverse-magnetostriction effect for high sensitivity and temperature stability while being compatible with semiconductor processes, enabling cost-effective and efficient measurement of external physical quantities.
Implementation Method 1
the sensor chip employed the sensing principle of the inverse magnetostrictive effect has high sensitivity and temperature stability
Data Source
AI summary
A sensor chip has a supporting structure layer and a micro-inductor layer formed on the supporting structure layer and having an inductance. The micro-inductor layer comprises an insulating layer, at least one magnetic layer, and a micro-coil layer. When an external physical quantity is applied on sensor chip, the micro-inductor layer can deform correspondingly to generate a variation of the inductance. The variation of the inductance can be measured by an inductance measurement circuit. The inductance measurement circuit can be an external circuit or be integrated into the sensor chip.