Sensor Chip Monolithic Integration for Redundant Magnetic Field Measurement
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Solution Overview
Problem
Existing sensor systems require multiple sensors for improved measurement accuracy, but achieving structural homogeneity and redundancy is challenging, leading to suboptimal measurement robustness, especially in differential magnetic field measurements.
Innovation Solution
A sensor chip with multiple identical sensor circuits monolithically integrated onto a common semiconductor substrate, allowing for independent operation and redundancy, with each sensor circuit including amplifiers and comparators, and packaged in a compact wafer level ball grid array package for enhanced accuracy and robustness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple sensors are implemented using dedicated chips, then sensor redundancy is achieved, but structural homogeneity and matching accuracy deteriorate
Solution Approach 1:
The patent combines multiple identical sensor circuits onto a single semiconductor substrate, creating a multi-sensor integrated circuit. This merging approach ensures that all sensors share the exact same structural characteristics and manufacturing variations, achieving both redundancy and high matching accuracy. The sensors are positioned in close proximity on the substrate, allowing them to function as redundant measurement units while maintaining identical structural properties.
2Measurement precision
If sensors are positioned close together on the substrate, then structural homogeneity improves, but measurement independence deteriorates due to interference
Solution Approach 1:
The patent applies local quality differentiation by providing individual shielding structures for each sensor circuit. While the sensors are positioned close together to maintain structural homogeneity, each sensor is equipped with its own shielding that creates a localized protective environment. This allows the sensors to benefit from close proximity for matching purposes while the individual shields prevent mutual interference, maintaining measurement independence.
3Reliability
If multiple dedicated sensor chips are used, then measurement independence is maintained, but device complexity and production costs increase
Solution Approach 1:
The patent merges multiple sensor circuits into a single integrated circuit on one semiconductor substrate, dramatically reducing production complexity. Instead of manufacturing, packaging, and assembling multiple separate chips, the invention produces one chip containing all sensor circuits. This single-substrate approach simplifies the entire production chain while maintaining measurement independence through proper circuit isolation and shielding design.
Solution Approach 2:
The semiconductor substrate serves multiple functions simultaneously: it acts as the structural platform for all sensor circuits, provides mechanical support, enables electrical interconnections, and facilitates unified packaging. This multi-functionality of the substrate reduces the need for additional components and assembly steps, thereby reducing overall device complexity while maintaining all necessary measurement capabilities.
Data Source
AI summary
The present disclosure relates to a sensor chip, including a semiconductor substrate, a first sensor circuit monolithically integrated into the semiconductor substrate, at least one second sensor circuit monolithically integrated into the semiconductor substrate, wherein the first and second integrated sensor circuits are embodied identically.