3D Sensor Chip with Opposing Coils for Magnetic Field Reinforcement
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Solution Overview
Problem
Current sensor chips face challenges in achieving high magnetic field strength and sensitivity due to heat generation issues when large currents are applied, and noise interference from amplifiers, while also being bulky and costly due to multiple board layers.
Innovation Solution
A sensor chip design featuring a three-dimensional object with coils on opposing surfaces generating magnetic fields in the same direction, utilizing a magnetic measurement element like a Hall element, and a simplified configuration that reduces size and noise, enhancing sensitivity and magnetic field strength by reinforcing magnetic fields and increasing mutual inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If large current is applied to generate high magnetic field strength, then magnetic field strength is improved, but heat generation increases
Solution Approach 1:
Multiple coils (first coil and second coil) are combined to generate magnetic fields in the same direction, reinforcing the total magnetic field strength without requiring excessive current in a single coil, thereby reducing heat generation
Solution Approach 2:
The patent transitions from a planar two-dimensional arrangement to a three-dimensional configuration with coils on opposing surfaces of a substrate, enabling magnetic field reinforcement through spatial positioning rather than increasing current magnitude
2Measurement precision
If multiple board layers are used to achieve high sensitivity, then sensitivity is improved, but device size and manufacturing cost increase
Solution Approach 1:
The patent utilizes three-dimensional space by positioning coils on opposing surfaces of a substrate with a magnetic measurement element in between, achieving high sensitivity without requiring multiple stacked board layers, thus reducing device size and simplifying manufacturing
3Measurement precision
If multiple board layers are used to achieve high sensitivity, then sensitivity is improved, but manufacturing cost increases
Solution Approach 1:
By transitioning to a three-dimensional configuration with coils on opposing surfaces, the patent achieves high sensitivity without the need for complex multi-layer board stacking, thereby reducing manufacturing complexity and cost
Solution Approach 2:
The configuration merges the functional elements (coils and magnetic measurement element) into a compact three-dimensional arrangement that achieves high sensitivity without requiring multiple separate board layers, simplifying the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a five-fold increase in magnetic field strength, reduces heat generation, and enhances sensitivity, allowing for a compact, cost-effective, and highly sensitive sensor chip with improved symmetry and reduced noise interference.
Implementation Method 1
a first coil provided on the first surface; a second coil provided on the second surface... directions of magnetic fields generated in the first coil and the second coil by current for electrically conducting the first coil and the second coil are the same
Implementation Method 2
A sensor chip (current detection device) detects a magnetic field generated by a current flowing in a coil by using a magnetosensitive portion such as a Hall element
Data Source
AI summary
Provided is a sensor chip including: a board; a three-dimensional object provided on the board, the three-dimensional object being a cuboid or a cube having a first surface and a second surface facing the first surface and including an insulating material; a first coil provided on the first surface; a second coil provided on the second surface, the second coil being electrically connected to the first coil; and a magnetic measurement element provided in the three-dimensional object. Directions of magnetic fields generated in the first coil and the second coil by current for electrically conducting the first coil and the second coil are the same.