Sensor Chip Package Assembly Using Metal Substrate
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Solution Overview
Problem
The existing sensor chip package assembly using PCB substrates has a long development period, high cost, and significant warpage issues, which interfere with signal transmission due to interconnected bonding pads.
Innovation Solution
A sensor chip package assembly using a metal substrate with independent bonding pads and a packaging material cover that insulates adjacent pads, allowing for stable signal transmission between the sensor chip and the metal substrate, reducing development time and cost while minimizing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a PCB substrate is used for sensor chip package assembly, then electrical connection between sensor chip and substrate is achieved, but the bonding pads are interconnected causing signal interference and affecting accuracy
Solution Approach 1:
The bonding pads on the metal substrate are segmented into independent isolated pads rather than interconnected traces. Each bonding pad is electrically isolated from others, eliminating signal interference while maintaining electrical connection functionality. This segmentation approach directly resolves the contradiction by preventing harmful electromagnetic coupling between adjacent signal paths.
Solution Approach 2:
An insulating layer is introduced as an intermediary between adjacent metal bonding pads on the metal substrate. This insulating layer acts as a mediator that prevents direct electrical coupling and signal interference between pads, while still allowing each pad to maintain its electrical connection to the sensor chip bonding pads through the designated connection points.
2Ease of manufacture
If a PCB substrate is used for sensor chip package assembly, then mounting for sensor chip is provided, but warpage occurs affecting operation of subsequent assembly process
Solution Approach 1:
The substrate material is changed from PCB (composite material with high warpage tendency) to metal substrate (high thermal and mechanical stability). This parameter change in material composition fundamentally reduces warpage occurrence, enabling stable subsequent assembly processes while maintaining ease of manufacture through the metal substrate's inherent stability.
3Adaptability or versatility
If PCB substrate type package is adopted, then sensor chip mounting is achieved, but individual design is needed for each development resulting in longer development period and high cost
Solution Approach 1:
The metal substrate serves multiple functions simultaneously: it provides mechanical mounting support for the sensor chip, acts as an electrical connection platform through isolated bonding pads, and functions as a stable reference plane. This multi-functionality eliminates the need for individual PCB design iterations, reducing development time while maintaining design flexibility through the universal metal substrate platform.
Data Source
AI summary
A sensor chip package assembly and an electronic device having the sensor chip package assembly are disclosed, where the sensor chip package assembly includes: a metal substrate (100) which has a bonding pad region (11) and a placement region (12), the bonding pad region having a plurality of metal bonding pads (13); a sensor chip (200) which is located on an upper surface of the metal substrate, and the sensor chip having a plurality of sensor chip bonding pads (21); an electrical connection assembly (300) which electrically connects a metal bonding pad and a sensor chip bonding pad; and a packaging material cover (400) which covers the metal substrate, the sensor chip and the electrical connection assembly, where any two adjacent metal bonding pads are spaced in an insulated manner by the packaging material cover.