Sensor Chip Positioning for Magnetic Field Detection Accuracy
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Solution Overview
Problem
Existing sensor systems face challenges in achieving high detection accuracy while maintaining a small size, particularly in automated driving applications, where redundancy and continuity of sensor functions are crucial, and existing configurations often suffer from dispersion in magnetic field intensity detection due to differences in sensor chip arrangement.
Innovation Solution
A sensor system comprising multiple sensor packages with sensor chips positioned closer to the central distribution of a physical quantity, such as a magnetic field, with equal distances from the distribution center, and chip center-to-center distances shorter than package center-to-center distances, arranged in a configuration that minimizes dispersion and eliminates common failure factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensor packages are arranged with larger package center-to-center distance to reduce mutual interference, then reliability is improved, but detection accuracy deteriorates due to increased dispersion in magnetic field intensity detection
Solution Approach 1:
The patent applies local quality by differentiating the positioning strategy between sensor packages and sensor chips. While sensor packages maintain larger center-to-center distances for reliability, the sensor chips within each package are positioned with shifted central positions closer to the magnetic field distribution center. This local differentiation allows each chip to experience more uniform magnetic field intensity, reducing detection dispersion while preserving package-level reliability through spatial separation.
2Measurement precision
If sensor chips are positioned closer to the central position of physical quantity distribution to reduce detection dispersion, then detection accuracy is improved, but device complexity increases due to non-standard arrangement requirements
Solution Approach 1:
The patent implements local quality by applying different positioning strategies to different components: sensor packages are arranged in regular patterns for simplicity, while sensor chips within each package are locally shifted toward the magnetic field distribution center. This localized adjustment optimizes detection accuracy without requiring complete redesign of the overall sensor array geometry, thus limiting the increase in device complexity to only the chip-level positioning step.
3Reliability
If multiple sensor packages are used to achieve redundancy and continuity of sensor functions, then reliability is improved, but detection accuracy deteriorates due to dispersion in magnetic field intensity values across packages
Solution Approach 1:
The patent resolves this contradiction by applying local quality to the sensor chip positioning within each package. While multiple packages provide redundancy, the sensor chips in each package are locally shifted toward the magnetic field distribution center, ensuring that each chip experiences similar magnetic field intensity conditions. This local optimization ensures detection consistency across all packages, allowing redundancy to improve reliability without sacrificing measurement precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances detection accuracy by reducing dispersion in magnetic field intensity values and ensures high-level continuity and safety of sensor functions, allowing for superior performance in a compact form factor.
Implementation Method 1
a plurality of sensor packages including respective sensor chips configured to detect the physical quantity
Data Source
AI summary
A sensor system according to an embodiment of the disclosure includes a physical quantity distribution generation source configured to generate a distribution of a physical quantity, and a plurality of sensor packages including respective sensor chips configured to detect the physical quantity. In a plane including the sensor packages, central positions of the respective sensor chips are shifted in directions from central positions of the respective sensor packages toward a central position of the distribution of the physical quantity, and distances from the central position of the distribution of the physical quantity to the central positions of the respective sensor chips of the respective sensor packages are substantially equal to each other.