Sensor Module Casing Stabilizes Circuit Board Position

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Solution Overview

Problem

The assembly of sensor modules for detecting vibrational behavior in mechanical components, such as vehicle wheel bearings, is hindered by the inconsistent positioning of circuit boards due to varying contact areas, leading to instability and component waste during production.

Innovation Solution

A sensor module design featuring a casing with three equidistant contact areas to stabilize the circuit board, along with spacers and a potting material to secure the board within the casing, facilitating a stable assembly process and reducing waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If six contact areas are used in the casing, then the circuit board can be housed inside the casing, but the position of the circuit board becomes unstable and random during assembly

Engineering Contradiction:
Improvecasing structureVSAvoidcircuit board position
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The contact areas are segmented into exactly three specific locations on the casing base, each serving as a discrete support point. This segmentation provides defined positioning zones that guide the circuit board into a precise, repeatable position during assembly, eliminating the randomness caused by having six unstructured contact areas.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The three contact areas are positioned at specific locations: one at the front of the base and two at the rear of the base. This local differentiation creates asymmetric support points that naturally guide the circuit board into a unique, stable position, improving manufacturing precision while maintaining structural simplicity.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If multiple contact areas are provided in the casing, then the circuit board can be supported, but the assembly process becomes unstable and non-repetable

Engineering Contradiction:
Improveassembly processVSAvoidassembly stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The support structure is segmented into three discrete contact areas rather than multiple continuous or distributed contact zones. This segmentation creates distinct, identifiable positioning points that make the assembly process more stable and repeatable, as each contact area serves a specific function in locating the circuit board.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The number of contact areas is changed from six to three, and their positions are specifically defined (one at front, two at rear). This parameter change simplifies the assembly process while improving reliability, as fewer, well-defined contact points are easier to manufacture consistently and provide more stable positioning than multiple contact areas.

Inventive Principle:
Principle #35Parameter changes

3Device complexity

If the circuit board is positioned in a hyperstatic state, then it can be housed in the casing, but component waste increases due to sorting requirements

Engineering Contradiction:
Improvecasing structureVSAvoidcomponent waste
Core Design Contradiction:
Device complexityVSLoss of substance

Solution Approach 1:

The three contact areas are segmented into specific positions (one front, two rear) that create a natural, stable resting position for the circuit board. This segmentation eliminates the hyperstatic condition by providing exactly enough support points to stabilize the board without over-constraint, allowing consistent assembly without post-production sorting and reducing component waste.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The contact areas are positioned with specific local qualities: one at the front edge and two at the rear edge of the base. This local differentiation creates an asymmetric support configuration that naturally orients the circuit board in the correct position, eliminating the need for sorting operations and reducing component loss.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures a stable and efficient assembly process, reducing component waste and improving the reliability of vibrational data transmission from mechanical components.

Implementation Method 1

the circuit board comprises a piezoelectric vibration sensor

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20240077383A1Sensor module for detecting a vibrational behavior of a component
Publication Date: 2024.03.07 AB SKF SKF PATENT DEPARTMENT
  • US20240077383A1 patent drawing
  • US20240077383A1 patent drawing
  • US20240077383A1 patent drawing

AI summary

A sensor module (8) is disclosed for detecting a mechanical vibration of a component. The sensor module (8) includes a base (10) to be secured on the component. A circuit board (12) is mechanically connected to the base (10). The circuit board (12) has a first side (16) facing the base (10) and a second side (18) facing away from the base (10). A casing (34) inside which is housed the circuit board (12). The casing (34) includes only three contact areas against which the second side (18) of the circuit board (12) abuts.