Sensor Column for Multi-Zone Temperature Measurement
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Solution Overview
Problem
Existing methods for monitoring temperature and other process parameters across semiconductor substrates during processing are unreliable and impractical, especially as substrate size increases, due to variations in temperature across different locations and the limitations of infrared sensors and embedded thermal sensors.
Innovation Solution
A sensor column system with a tip and protective tube that synchronizes with the substrate support shaft to maintain contact and measure parameters like temperature at various locations, using a double bellows structure for vacuum sealing and spring force to ensure accurate readings across a wide temperature range.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If infrared sensors are used to measure temperature at various locations, then temperature monitoring capability is provided, but the system becomes expensive and unreliable due to dependence on emissivity changes
Solution Approach 1:
The patent replaces optical/infrared measurement systems with direct mechanical contact sensors. Temperature sensors are physically attached to the substrate support assembly, eliminating the need for infrared measurement through optical windows and removing dependence on emissivity characteristics.
Solution Approach 2:
The patent introduces physical contact as an intermediary between the measurement system and the substrate support. Rather than measuring temperature remotely through radiation, sensors make direct thermal contact with the substrate support assembly, providing stable and reliable measurements.
2Measurement precision
If multiple thermal sensors are embedded in the substrate support, then temperature monitoring is achieved, but the solution becomes impractical for wide ranges of processing temperatures
Solution Approach 1:
The patent employs sensors that can dynamically adapt to different temperature ranges through physical attachment rather than embedding. The sensor system can be configured and repositioned for different processing temperatures, providing versatility across wide temperature ranges while maintaining measurement capability.
3Area of stationary object
If substrate size increases, then processing capability is improved, but maintaining uniform temperature across the substrate support becomes challenging
Solution Approach 1:
The patent divides the temperature measurement function into multiple discrete sensor locations across the substrate support assembly. By placing sensors at different radial positions and implementing independent heating zones, the system can monitor and control temperature uniformity across large substrate areas.
Solution Approach 2:
The patent implements localized temperature control and measurement at different regions of the substrate support. Each zone can be independently monitored and controlled, allowing non-uniform heating patterns to be compensated to achieve uniform substrate temperature despite large substrate size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Provides a reliable and cost-effective method for monitoring process parameters, ensuring uniform temperature measurement across the substrate support, independent of thermal expansion and emissivity changes, facilitating precise control in semiconductor processing.
Implementation Method 1
a tip for contacting a chamber component being measured
Implementation Method 2
a protective tube having an inner volume extending from a first end and second end, wherein the tip is attached to the first end of the protective tube and seals the protective tube at the first end
Data Source
AI summary
Embodiments of the present disclosure generally provide apparatus and methods for monitoring one or more process parameters, such as temperature of substrate support, at various locations. One embodiment of the present disclosure provides a sensor column for measuring one or more parameters in a processing chamber. The sensor column includes a tip for contacting a chamber component being measured, a protective tube having an inner volume extending from a first end and second end, wherein the tip is attached to the first end of the protective tube and seals the protective tube at the first end, and a sensor disposed near the tip. The inner volume of the protective tube houses connectors of the sensor, and the tip is positioned in the processing chamber through an opening of the processing chamber during operation.