Sensor Commonality Platform Using Adaptable Sensors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of multiple physical parameter sensors from different vendors into a unified system is complex and costly due to the lack of commonality in signal conditioning, communications, and control, leading to high development costs and total cost of ownership.
Innovation Solution
A sensor-centric platform is developed where multiple sensor types share identical core sensor electronics, with varying mechanical structures to accommodate different measurements, eliminating the need for individual translators and conditioning electronics, allowing for plug-and-play functionality and reduced complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sensor types from different vendors are integrated into a unified system, then measurement capability and versatility are improved, but system complexity and integration cost increase
Solution Approach 1:
The patent implements a universal sensor interface that can accommodate multiple sensor types (force, pressure, torque, acceleration, etc.) from different vendors through a common mounting structure and signal conditioning system. The interface uses standardized electrical connections and a unified signal processing architecture that automatically adapts to different sensor outputs, eliminating the need for separate integration pathways for each sensor type.
Solution Approach 2:
The patent introduces an intermediary signal conditioning circuitry that acts as a mediator between diverse sensor outputs and the control system. This intermediary layer includes voltage followers, buffer amplifiers, and standardized voltage dividers that normalize signals from different vendors before they reach the main processing unit, thereby simplifying the overall system integration.
2Adaptability or versatility
If multiple sensor types from different vendors are integrated into a unified system, then measurement capability and versatility are improved, but integration cost increases
Solution Approach 1:
The patent implements a universal sensor interface that can accommodate multiple sensor types (force, pressure, torque, acceleration, etc.) from different vendors through a common mounting structure and signal conditioning system. The interface uses standardized electrical connections and a unified signal processing architecture that automatically adapts to different sensor outputs, eliminating the need for separate integration pathways for each sensor type.
Solution Approach 2:
The patent employs homogeneous signal conditioning approaches across all sensor types, using identical voltage follower circuits, buffer amplifiers, and voltage divider networks regardless of the sensor vendor or type. This standardization reduces component variety, simplifies manufacturing, and lowers integration costs while maintaining compatibility with diverse sensor inputs.
3Adaptability or versatility
If individual translators and conditioning electronics are used for each sensor type, then sensor compatibility is improved, but device complexity increases
Solution Approach 1:
The patent merges the functionality of individual translators and conditioning electronics into a single integrated interface circuitry. Instead of having separate conditioning circuits for each sensor type, the system uses a unified architecture where voltage followers, buffer amplifiers, and signal normalization circuits are combined into a common interface that handles all sensor types through standardized pathways.
Solution Approach 2:
The patent implements a universal sensor interface that can accommodate multiple sensor types (force, pressure, torque, acceleration, etc.) from different vendors through a common mounting structure and signal conditioning system. The interface uses standardized electrical connections and a unified signal processing architecture that automatically adapts to different sensor outputs, eliminating the need for separate integration pathways for each sensor type.
Data Source
AI summary
Disclosed herein is a sensor commonality platform comprising a plurality of adaptable sensors for customizable applications. Each adaptable sensor comprises a displacement structure for reacting to changes in a measurable physical property and a core sensor electronics module for measuring displacement of the displacement structure in response to the changes in the measurable physical property. At least one sensor has a displacement structure different than that of another sensor, with the core electronics being the same.


