Sensor Assembly Contact Structure for Compact EMI-Resistant Electronics
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Solution Overview
Problem
Miniaturized electronic devices face challenges in integrating multiple sensors and antennas within a compact form factor while maintaining electromagnetic interference and power consumption.
Innovation Solution
Integration of a sensor assembly that is easily placed in a narrow space and connected to a main circuit board without using connectors or wires.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If sensors and antennas are integrated within a compact form factor, then device size is reduced, but electromagnetic interference increases
Solution Approach 1:
The patent divides the internal space into distinct regions: a sensor assembly region containing multiple sensors, an antenna region containing antennas, and a conductive plate region. This spatial segmentation allows electromagnetic waves to be directed away from sensors while maintaining compact device dimensions, thereby reducing electromagnetic interference without increasing device size.
Solution Approach 2:
The patent introduces a conductive plate as an intermediary element positioned between the antenna region and the sensor assembly region. This conductive plate acts as a shield or barrier that blocks electromagnetic interference from reaching the sensors while allowing the antennas to function effectively, thus enabling compact integration without harmful interference.
2Reliability
If connectors or wires are used to connect sensor assembly to main circuit board, then electrical connection is achieved, but device complexity increases
Solution Approach 1:
The patent merges the electrical connection function directly into the sensor assembly structure itself. The sensor assembly includes integrated contact members that are part of the assembly's own structure, eliminating the need for separate connectors or wires. This integration maintains reliable electrical connection to the main circuit board while significantly reducing device complexity.
Solution Approach 2:
The patent extracts and eliminates the separate connectors and wires from the overall device structure. By incorporating electrical connection capabilities directly into the sensor assembly as integral components, the design removes unnecessary elements that would increase complexity, achieving both reliable connection and simplified structure.
3Adaptability or versatility
If multiple sensors are integrated in narrow space, then sensor functionality is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The patent creates a dedicated sensor assembly region that is spatially separated from other components like antennas and the main circuit board. This segmentation provides a controlled environment for housing multiple sensors, allowing them to be mounted with standard precision requirements rather than requiring ultra-precise placement throughout the entire device, thus enhancing sensor functionality while maintaining manageable manufacturing precision.
Solution Approach 2:
The conductive plate serves as a mounting substrate or intermediary surface for the sensor assembly. This provides a stable, easily manufacturable base that simplifies the placement and securing of multiple sensors, reducing the stringency of manufacturing precision requirements while still enabling dense sensor integration for enhanced functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances design freedom and connectivity of sensors within a miniaturized electronic device, reducing electromagnetic interference and enhancing sensor performance.
Implementation Method 1
an elastic member comprising an elastic material disposed between the printed circuit board and the sensor assembly
Data Source
Figure 1
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Figure 4
AI summary
According to an embodiment disclosed herein, an electronic device may comprise: a housing that includes a first surface and a second surface facing the opposite direction as the first surface; a printed circuit board disposed in a space between the first surface and the second surface; a sensor assembly including at least one sensor, which is disposed between the first surface and the printed circuit board, and first contact members, which include conductive materials disposed on surfaces facing the printed circuit board; an elastic member including an elastic material and disposed between the printed circuit board and the sensor assembly; and a conductive plate disposed between the printed circuit board and the elastic member. In an embodiment, at least one of the first contact members can be electrically connected to the printed circuit board.