Sensor Cooling Jacket Channels for Semiconductor Temperature Accuracy
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Solution Overview
Problem
Existing heat transfer solutions for semiconductor manufacturing are inadequate in efficiently cooling sensor devices, leading to accuracy issues and reduced operational lifespans due to thermal loading and limited cooling capabilities.
Innovation Solution
A heat transfer jacket with fluid channels and partition walls is designed to cool sensor devices, featuring a serpentine or helical flow path to effectively manage temperature gradients and maintain components within optimal operating temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensor devices are used to measure properties during substrate processing, then measurement capability is improved, but sensor devices heat up which hinders measurement accuracy and degrades the sensors
Solution Approach 1:
The cooling system is segmented into multiple fluid channels with partition walls, allowing independent temperature control zones. The jacket is divided into multiple sections that can be cooled separately, enabling precise temperature management at different sensor locations without uniform overheating.
Solution Approach 2:
A cooling fluid acts as an intermediary between the heat source (sensor device) and the environment. The fluid absorbs excess heat from the sensor through the jacket walls and transports it away, maintaining sensor temperature within operational limits while allowing continuous measurement.
2Temperature
If efforts are made to cool sensor devices, then temperature control is improved, but design and fabrication complexity increases and modularity is limited
Solution Approach 1:
The cooling jacket serves multiple functions simultaneously: it provides structural support for the sensor device, acts as a thermal management system through integrated fluid channels, and offers mechanical mounting features through flanges. This multi-functionality reduces the need for separate cooling components, simplifying overall design.
Solution Approach 2:
The cooling system parameters (fluid flow rate, channel geometry, partition wall configuration) can be adjusted to optimize temperature control without changing the fundamental jacket structure. This allows flexible temperature management while maintaining design simplicity and modularity.
3Productivity
If sensor devices operate at high temperatures, then processing efficacy is maintained, but operational lifespan of sensors is reduced
Solution Approach 1:
The cooling system is designed to remove heat before it can cause thermal damage to the sensor device. By continuously circulating cooling fluid through the jacket during operation, the system prevents thermal accumulation that would otherwise lead to sensor degradation and failure, extending operational lifespan.
Solution Approach 2:
The heat generated by sensor operation during substrate processing is converted from a harmful factor into a manageable parameter. The cooling system captures this thermal energy and dissipates it controlledly, allowing the sensor to operate continuously at optimal temperatures without degradation, thereby maintaining processing efficacy while extending sensor life.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces maximum temperatures and pressure drops, extends the lifespan of sensor mounting brackets and sensors, improves measurement accuracy, and increases maintenance intervals, thereby enhancing processing efficacy and throughput.
Implementation Method 1
a cooling fluid is flowed through the jacket to cool the temperature sensor
Implementation Method 2
a cooling fluid is flowed through the jacket to cool the temperature sensor
Data Source
AI summary
The present disclosure relates to heat transfer jackets and sensor assemblies, and related methods and processing chambers, for semiconductor manufacturing. In one or more embodiments, a jacket applicable for semiconductor manufacturing includes one or more outer walls bounding a plurality of fluid channels, and an inner wall at least partially surrounded by at least one of the plurality of fluid channels. The inner wall at least partially defines a receptacle opening. The jacket includes a fluid inlet formed in at least one of the one or more outer walls, a fluid outlet formed in at least one of the one or more outer walls, and a plurality of partition walls separating the plurality of fluid channels. At least one of the plurality of partition walls intersects at least one of the one or more outer walls.