Sensor Cooling for Semiconductor Mold Inspection
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in detecting and removing foreign matters, such as resin waste and burrs, during the resin sealing process, which can lead to deformation of wires, short circuits, and void defects, particularly in high-speed mass production environments where visual inspection is inefficient and labor-intensive.
Innovation Solution
A manufacturing method that incorporates a sensor integrated with an arm for inspecting the mold surfaces during the lead frame unloading process, allowing for simultaneous cleaning and detection of foreign matters, using a line sensor to photograph and analyze the mold surfaces for foreign objects, and a cooling mechanism to maintain sensor effectiveness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If visual confirmation is used to detect resin waste on mold surfaces, then detection capability is provided, but the moving speed of the cleaning mechanism must be reduced to 20-30 mm/sec
Solution Approach 1:
The patent replaces the mechanical visual inspection system with an optical sensor system (line sensor or area sensor) that can detect resin waste at high speeds. The sensor captures images of the mold surface and uses image processing to identify foreign matters, eliminating the need to slow down the cleaning mechanism while maintaining detection capability.
Solution Approach 2:
The patent introduces an image processing system as an intermediary between the sensor and the detection function. The sensor captures images at high speed, and the image processing unit analyzes these images to detect resin waste, allowing the system to maintain both high speed operation and detection accuracy.
2Measurement precision
If visual confirmation is used to detect resin waste, then detection is possible, but the size of detectable foreign matters is limited to several millimeters
Solution Approach 1:
The patent replaces human visual inspection with optical sensors (line sensor or area sensor) that have superior resolution capabilities. These sensors can detect foreign matters as small as several micrometers, far exceeding the several millimeter limitation of human vision, thereby improving detection precision without compromising manufacturing precision.
3Measurement precision
If a sensor is placed near the heated mold surface for inspection, then detection function is provided, but the sensor temperature increases reducing its lifespan
Solution Approach 1:
The patent introduces a cooling mechanism as an intermediary between the sensor and the heated mold environment. The cooling mechanism actively removes heat from the sensor, maintaining it at an appropriate operating temperature while allowing the sensor to remain positioned near the mold surface for effective detection.
Solution Approach 2:
The patent changes the temperature parameter of the sensor by implementing active cooling. This allows the sensor to operate in a high-temperature environment near the mold without being damaged, extending its lifespan while maintaining detection functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient detection and removal of foreign matters at high speeds, reducing yield loss and labor costs, while maintaining sensor performance and extending its lifespan by integrating cooling and inspection processes.
Implementation Method 1
a sensor... to photograph the main surface of the heated mold
Implementation Method 2
a cooling mechanism to cool the sensor
Data Source
AI summary
A manufacturing method of a semiconductor device includes the steps of: preparing a lead frame; mounting a plurality of semiconductor chips on the lead frame; and sealing one portion of the lead frame with a sealing resin. The resin-sealing step includes the step of: disposing the lead frame, molds having main surfaces on which cavity parts are formed, the lead frame being disposed on the main surface of the heated molds; injecting a resin in the main surfaces of the heated molds so as to seal the one portion of the lead frame with the sealing resin; and taking out the lead frame from the heated molds. In the taking-out step, while the lead frame is taken out, the main surfaces of the molds are inspected by using a sensor, and the sensor is cooled and formed integrally with an arm used for taking out the lead frame.