Temperature Sensor Thermal Path via Copper Trace
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Solution Overview
Problem
Power controllers using solid state switching devices face heat dissipation issues due to voltage drops across transistor junctions, leading to potential device damage and increased costs with large heat sinks.
Innovation Solution
A system comprising a circuit board with a solid state switching device, a heat sink, and a temperature sensor, where the temperature sensor is in thermal communication with the switching device through the heat sink and a copper trace, allowing for real-time temperature monitoring and control of power dissipation via a processor that adjusts pulse width modulation and fan operation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a large heat sink is used to dissipate heat from the solid state switching device, then heat dissipation capability is improved, but device size and cost increase
Solution Approach 1:
The patent introduces a copper trace as an intermediary thermal conduction path between the heat sink and the temperature sensor. This copper trace acts as a thermal mediator that efficiently transfers heat from the solid state switching device through the heat sink to the temperature sensor, enabling accurate temperature monitoring without requiring the sensor to be in direct contact with the switching device. This resolves the contradiction by providing effective heat dissipation and monitoring while maintaining compact dimensions.
2Measurement precision
If a temperature sensor is placed in direct contact with the solid state switching device, then temperature measurement accuracy is improved, but electrical isolation requirements and device complexity increase
Solution Approach 1:
The copper trace serves as a thermal intermediary that decouples the temperature sensor from direct electrical contact with the solid state switching device. The trace conducts heat thermally while maintaining electrical isolation, allowing the temperature sensor to accurately monitor switching device temperature without compromising electrical safety or increasing device complexity.
Solution Approach 2:
The patent extracts the temperature sensing function from direct contact with the switching device and relocates it to a position where it can monitor temperature through the thermal path of the copper trace and heat sink. This separation allows independent optimization of the sensing location while maintaining measurement accuracy through the thermal conduction path.
3Power
If the solid state switching device operates at high current, then power delivery capability is improved, but heat generation and power loss increase
Solution Approach 1:
The patent implements a feedback mechanism where the temperature sensor continuously monitors the temperature of the solid state switching device through the copper trace and heat sink path. This temperature information is fed back to the control system, which can then adjust operating parameters to prevent excessive heat generation, optimize power delivery, and protect the device from thermal damage. This resolves the contradiction by enabling high current operation with intelligent thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces power dissipation and heat buildup in solid state switching devices, preventing damage and minimizing the need for large heat sinks, thus enhancing reliability and reducing costs.
Implementation Method 1
The heat sinks are often made of metals with a high thermal conductivity allowing the heat to quickly travel away from the device
Implementation Method 2
heat sinks generally have a large surface area allowing for more rapid dissipation of the heat into the surrounding environment through convection
Implementation Method 3
the temperature sensor may be in thermal communication with the solid state switching device through the trace and the heat sink to determine the temperature of the solid state switching device
Implementation Method 4
Some electrical power is converted to heat as the electrons flow through the junctions
Data Source
AI summary
An improved system and method measuring a temperature in a power controller is provided. The system includes a circuit board, a solid state switching device, a heat sink, and a temperature sensor. The solid state switching device may be mounted on the circuit board and controls the switching of power to an industrial load. The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board. The temperature sensor may be in thermal communication with the trace. As such, the temperature sensor may be in thermal communication with the solid state switching device through the trace of the circuit board.