Sensor Cover Compliant Pins PCB Spacing
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Solution Overview
Problem
Existing sensor assemblies lack improvements in design and materials, particularly in the mechanical and electrical connections between printed circuit boards, which can affect the accuracy and durability of pressure sensors under varying fluid pressures.
Innovation Solution
A sensor assembly design featuring a cover with compliant pins as the sole mechanical connection between upper and lower printed circuit boards, along with support features and vents, to maintain mechanical spacing and distribute force evenly, ensuring accurate pressure sensing without significant error.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If traditional rigid mechanical connections are used between printed circuit boards, then structural strength is improved, but measurement precision deteriorates due to force transmission errors affecting pressure sensor accuracy
Solution Approach 1:
The patent introduces a cover as an intermediary component between the upper and lower printed circuit boards. This cover includes compliant pins that act as a mediator to transmit mechanical forces, isolating the pressure sensor from direct force transmission through rigid connections. The compliant pins provide a flexible connection that reduces force transmission errors while maintaining structural integrity, thereby improving measurement precision without sacrificing structural strength.
2Reliability
If multiple mechanical connection points are used between printed circuit boards, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple connection functions into a single integrated cover component. The cover simultaneously provides mechanical support, electrical insulation, and multiple connection points through its integrated structure with compliant pins. This merging approach maintains reliability through multiple connection points while reducing device complexity by eliminating the need for separate fasteners, insulators, and mounting brackets that would otherwise be required.
3Stability of the object's composition
If the cover engages each printed circuit board at multiple locations, then stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs compliant pins that change their mechanical parameters under load. These pins are designed to deflect and conform to slight variations in hole alignment between the cover and printed circuit boards. By allowing the pins to change their position and orientation parameters in response to manufacturing tolerances, the system achieves stable mechanical spacing without requiring extremely tight manufacturing precision at the engagement locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy and durability of pressure sensors by maintaining mechanical spacing and distributing force evenly, reducing output errors to less than 10% and ensuring reliable operation under various pressure conditions.
Implementation Method 1
The compliant pins may be the sole mechanical connection between upper and lower printed circuit board
Data Source
AI summary
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.