Sensor Cover Heating Contact Design for Injection Overmolding
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Solution Overview
Problem
Existing heating mechanisms for sensor assemblies in motor vehicles face challenges in electrical contacting, particularly during integration into plastic components, requiring complex and costly production processes, and are prone to being covered by plastic layers, leading to inefficient de-icing in adverse weather conditions.
Innovation Solution
A heating mechanism with a push-through contacting element, comprising a film contact portion and a connection contact portion, which is electro-conductively connected to conductor paths and secured through a counter-contact element, allowing for secure and cost-effective integration without the need for semi-finished products or complex tooling, enabling reliable electrical connection to a power source.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the heating mechanism is injection-overmolded with a plastic layer, then the integration into the cover element is improved, but the electrical contact areas are covered and require complex exposure processes
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the plastic layer at the locations where electrical contacts are needed, before the injection molding process is completed. This allows the heating mechanism's electrical contacts to be accessible from the beginning, eliminating the need for complex post-processing exposure steps while maintaining the benefits of injection-overmolding integration.
2Stability of the object's composition
If the heating mechanism is integrated into the plastic layer, then the structural stability is improved, but the electrical contacting becomes difficult and requires high precision
Solution Approach 1:
The patent segments the electrical contacting function by providing separate recesses in the plastic layer for each electrical contact area. This segmentation allows each contact point to be independently accessed and connected, reducing the precision requirements compared to creating through-holes or complex routing paths, while maintaining the structural stability of the integrated design.
3Manufacturing precision
If complex tooling is used for integration, then the manufacturing precision is improved, but the production cost increases
Solution Approach 1:
The patent merges the heating mechanism integration with the standard injection molding process by incorporating recess formation as part of the mold design itself. This combining of functions eliminates the need for separate, complex tooling steps or post-processing operations, achieving high integration precision while using conventional injection molding equipment, thereby reducing production costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies and cost-reduces the integration of heating mechanisms, ensuring stable and secure electrical contacting, facilitating efficient de-icing of sensor assemblies even in adverse weather conditions, thereby enhancing the reliability and longevity of sensor operations.
Implementation Method 1
a heating mechanism, which comprises conductor paths or a surface heating layer, which are disposed on the inner side of the cover element
Data Source
AI summary
A heating mechanism for a cover element of a sensor assembly, the heating mechanism may have a plurality of electrically connected conductor paths applied to a backing film and/or a heating film applied to the backing film. The heating mechanism may have at least one electrical push-through contacting element, which has a film contact portion and a connection contact portion, and a counter-contact element, the film contact portion being electro-conductively connected to at least one of the plurality of conductor paths and/or the heating film, the connection contact portion being inserted through the backing film and protruding relative to the backing film, and the counter-contact element being attached to the connection contact portion so that the film contact portion is counter-secured relative to the counter-contact element with at least the backing film interposed, and the connection contact portion being configured to be connected to a terminal of an electrical source.