Photoelectric Sensor Cover Protrusion for Sealing

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Solution Overview

Problem

The high manufacturing costs of photoelectric sensors due to the need for multiple molds in producing covers with protruding portions, which increases the complexity and expense of the sealing process, while existing methods do not provide excellent sealing properties.

Innovation Solution

A photoelectric sensor design featuring a cover with a protruding portion on its surface that intersects the side wall, allowing for improved adhesion with the sealing member through heat softening, enabling die casting instead of split molding and enhancing sealing performance by extending the protruding portion along the side wall and periphery.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protruding portion is provided on the outer wall of the cover to increase adhesion with the sealing member, then sealing properties are improved, but manufacturing complexity increases due to the need for split molds instead of punching molds

Engineering Contradiction:
Improvesealing propertiesVSAvoidmolding process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The protruding portion is repositioned from the outer wall (perpendicular to side wall) to the side surface (parallel to side wall), changing the dimensional orientation. This allows the protruding portion to be formed using simple punching molds rather than complex split molds, reducing manufacturing complexity while maintaining sealing functionality

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The cover structure is designed to serve multiple functions: the side surface with protruding portion provides both structural support and sealing adhesion, while the overall cover design accommodates both the punching mold process and the sealing member attachment, reducing the need for specialized complex molding processes

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Reliability

If multiple molds are prepared to produce covers with protruding portions, then sealing properties are improved, but manufacturing costs increase

Engineering Contradiction:
Improvesealing propertiesVSAvoidmanufacturing cost
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

By repositioning the protruding portion to the side surface rather than the outer wall, the design enables the use of simple punching molds instead of expensive split molds, significantly reducing manufacturing costs while preserving the sealing enhancement function

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The design uses a simple, inexpensive punching mold process instead of costly split molds. The protruding portion is created through a straightforward punching operation that can be performed with basic tooling, making the manufacturing process more cost-effective

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces manufacturing costs and improves sealing properties by increasing adhesion between the cover and sealing member, allowing for more efficient and cost-effective production of photoelectric sensors with enhanced protection for internal components.

Implementation Method 1

when a high-temperature sealing member comes into contact with the cover, the protruding portion is more likely to transmit heat as compared with other portions and is easily softened

Methodology Applied
Scientific EffectHeat transmission: Conduction (thermal)

Implementation Method 2

the protruding portion is more likely to transmit heat as compared with other portions and is easily softened

Methodology Applied
Scientific EffectThermal softening: Melting

Data Source

PatentEP3540389B1Photoelectric sensor
Publication Date: 2024.03.13 OMRON CORP
  • EP3540389B1 patent drawingFigure 1
  • EP3540389B1 patent drawingFigure 2
  • EP3540389B1 patent drawingFigure 3

AI summary

A photoelectric sensor (100) including at least one of a light projecting unit emitting light and a light receiving unit detecting light includes a substrate (20) on which at least one of the light projecting unit and the light receiving unit is mounted, a cover which has a protecting portion (10) facing the substrate (20) and for protecting the substrate (20) and a side wall (11) extending from a periphery of the protecting portion (10), and a sealing member (25) which seals at least one of the light projecting unit and the light receiving unit that is mounted on the substrate (20), in which the cover has a protruding portion (14) on a surface which is positioned outside a side surface (20a) of the substrate (20) and intersects an extending direction of the side wall (11), and the protruding portion (14) is in contact with the sealing member (25).