High Temperature Sensor CTE Blending Medium
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Solution Overview
Problem
Current proximity sensors used in downhole applications are not robust enough to withstand temperatures exceeding 700° C for sustained periods due to differing coefficients of thermal expansion between the base and conductor, leading to delamination and short service life.
Innovation Solution
A high temperature sensor is formed by preparing a substrate with a specific coefficient of thermal expansion from an electrically insulative material and an electrical conductor with a different coefficient of thermal expansion, using a CTE blending medium at the interface to accommodate thermal expansion rates, preventing delamination and ensuring operational stability at temperatures above 700° C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If current proximity sensors are used in downhole applications, then they can detect formation parameters and tool positions, but they cannot withstand temperatures exceeding 700° C due to delamination caused by differing coefficients of thermal expansion
Solution Approach 1:
A CTE blending medium is introduced as an intermediary layer between the substrate and electrical conductor. This intermediate layer has a coefficient of thermal expansion that is intermediate between the substrate and conductor, thereby accommodating the thermal expansion mismatch and preventing delamination at high temperatures up to 1000° C.
Solution Approach 2:
The patent changes the physical parameter (coefficient of thermal expansion) of the interface layer by using a CTE blending medium. This parameter change allows the system to accommodate thermal expansion differences between dissimilar materials, enabling operation at temperatures exceeding 700° C without delamination.
2Duration of action of stationary object
If a CTE blending medium is used at the interface between substrate and conductor, then thermal expansion mismatch is accommodated and service life is extended, but device complexity increases
Solution Approach 1:
The CTE blending medium is applied locally only at the interface region where thermal expansion mismatch occurs, rather than throughout the entire sensor. This localized approach addresses the specific problem area while minimizing overall device complexity and maintaining simplicity in other regions of the sensor.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively extends the service life of downhole sensors by maintaining operational integrity and preventing thermal-related failures at extreme temperatures, enhancing their robustness and reliability in high-temperature environments.
Implementation Method 1
Differing coefficients of thermal expansion between a base and a conductor results in delamination after a short service life
Data Source
AI summary
A method of forming a high temperature sensor includes preparing a substrate having a surface from an electrically insulative material having a first coefficient of thermal expansion (CTE), preparing an electrical conductor from a metal material having a second CTE that is different from the first CTE, and creating an interface between the electrical conductor and the substrate with a CTE blending medium that is provided between the substrate and the electrical conductor. The CTE blending medium accommodates differing thermal expansion rates of the substrate and the electrical conductor at temperatures of at least 700° C.