Sensor Device Thermal Isolation via Divided Casing

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Solution Overview

Problem

Existing thermal sensor devices face a decline in sensing accuracy due to thermal influence from the control unit, which is transferred to the sensor elements through the casing.

Innovation Solution

The sensor device incorporates a substrate with a heat generation portion and a casing with divided accommodation spaces to reduce thermal influence on the sensor elements, improving sensing accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the control unit is incorporated in the substrate and accommodated in the casing, then the device integration is improved, but heat from the control unit is transferred to the sensor element through the casing causing sensing accuracy to decline

Engineering Contradiction:
Improvedevice integrationVSAvoidsensing accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The accommodation portion of the casing is divided into multiple accommodation spaces using division plates. The sensor element is placed in a first accommodation space while the control unit is placed in a second accommodation space, physically separating the heat-generating component from the temperature-sensitive component. This segmentation prevents heat transfer from the control unit to the sensor element, resolving the contradiction between device integration and sensing accuracy.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If the accommodation space is divided into multiple spaces using division plates, then thermal influence on the sensor element is reduced, but the device complexity increases

Engineering Contradiction:
Improvesensing accuracyVSAvoidcasing structure
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The casing is segmented into multiple accommodation spaces using division plates, which are simple planar partitions. This segmentation approach achieves thermal isolation effectively while maintaining relatively simple manufacturing processes. The division plates can be easily integrated into the existing casing structure, minimizing the increase in device complexity while achieving the goal of reducing thermal influence on the sensor element.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

By dividing the accommodation space within the casing and using a screw to secure the substrate, the sensor device effectively reduces thermal influence on the sensor elements, enhancing sensing accuracy.

Implementation Method 1

sensor elements each including a resistance element for flow sensing and a resistance element for temperature compensation

Methodology Applied
Scientific EffectTemperature-sensitive resistance: Electrical Resistance

Implementation Method 2

substrate including a heat generation portion

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS12332100B2Sensor device
Publication Date: 2025.06.17 KOA CORP
  • US12332100B2 patent drawing
  • US12332100B2 patent drawing
  • US12332100B2 patent drawing

AI summary

A sensor device according to the present invention includes a substrate including a heat generation portion, a casing including an accommodation portion accommodating the substrate, and a sensor element including a temperature-sensitive resistor and being supported by the substrate, in which the accommodation portion is divided into a plurality of accommodation spaces on a side closer to the sensor element. The accommodation portion is divided into a first accommodation space and a second accommodation space via division plates, and the first accommodation space is formed on a side closer to the sensor element than the second accommodation space, and widely as compared with the second accommodation space.