Physical Quantity Sensor Dicing Groove Design
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Solution Overview
Problem
The existing methods for manufacturing physical quantity detection sensors often result in chipping and cracking during the dicing process, leading to functional failures due to thermal stress and wire bonding, especially when substrates of different materials are bonded together.
Innovation Solution
A method involving the formation of a stacked structure with grooves in one of the substrates, allowing the dicing blade to penetrate and advance without contacting the surfaces, thereby reducing the generation of chipping and cracking by accommodating the blade within these grooves, which are wider than the blade itself.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a dicing blade is used to cut substrates of different materials in a stacked structure, then one substrate can be diced without problem, but chipping and cracks are generated in the other substrate
Solution Approach 1:
The patent introduces grooves that segment the dicing path, creating separate regions: one for blade accommodation and another for substrate cutting. This segmentation allows the blade to cut only the sensor substrate while the groove protects the different type substrate from direct blade contact, preventing chipping and cracks.
Solution Approach 2:
The groove acts as an intermediary structure between the dicing blade and the different type substrate. By providing this intermediate feature, the blade is guided to cut only the sensor substrate while the groove walls prevent the blade from contacting and damaging the different type substrate, thus mediating the interaction between cutting action and substrate integrity.
2Ease of manufacture
If chipping or crack is generated in a substrate, then thermal stress or load from wire bonding or mold can cause crack propagation, but these processes are necessary for sensor manufacturing
Solution Approach 1:
The groove structure provides beforehand cushioning by preventing chipping and crack generation during dicing. By designing the groove to accommodate the blade without contacting the different type substrate, the patent preemptively eliminates the source of defects that would later propagate under thermal stress or mechanical load during wire bonding and molding processes.
3Productivity
If the dicing blade contacts the surfaces on left and right sides of the groove, then cutting can proceed, but chipping and cracks are generated in the different type substrate
Solution Approach 1:
The groove design applies local quality by creating a specific geometric feature with controlled dimensions. The groove width is designed to be larger than the blade width, creating a localized region that accommodates the blade while the groove walls maintain a specific distance from the different type substrate surface, ensuring local protection against chipping and cracks.
Data Source
AI summary
A method of manufacturing a physical quantity detection sensor includes forming a stacked structure having a plurality of sensor devices by bonding together a sensor substrate and a different type substrate of a different material from a material of the sensor substrate, the sensor substrate having a plurality of sensor movable portions therein, and dicing the stacked structure using a dicing blade, wherein a groove is provided in one of the sensor substrate and the different type substrate to penetrate the one of the sensor substrate and the different type substrate, the groove having a width larger than a width of the dicing blade, and in at least part of the dicing, the dicing blade is accommodated in the groove and advances without contacting surfaces on left and right sides of the groove.