Embedded Sensor Die Package with Conductive Posts
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Solution Overview
Problem
There is a need for a semiconductor package that effectively embeds and protects semiconductor die while ensuring the operability of sensors formed on the die, requiring precise manufacturing methods to maintain sensor functionality.
Innovation Solution
The method involves providing a substrate with conductive posts, disposing a semiconductor die between them, forming an interconnect structure, and applying an adhesive and conductive layers, followed by encapsulation to protect the die and enhance electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If semiconductor die are embedded in substrate with conductive posts, then structural support and electrical connectivity are enhanced, but manufacturing precision requirements increase to maintain sensor operability
Solution Approach 1:
The substrate is segmented into multiple regions with conductive posts strategically positioned to provide localized structural support and electrical connectivity. The conductive posts are divided into individual discrete elements rather than a continuous structure, allowing precise placement around sensor die to enhance support without compromising sensor functionality through excessive constraint or stress.
Solution Approach 2:
Different regions of the substrate receive different treatments: areas with sensor die receive minimal structural intervention to preserve sensor operability, while other areas utilize conductive posts for enhanced structural support and electrical connectivity. The adhesive layer is applied selectively in specific regions rather than uniformly across the entire substrate, providing localized bonding where needed while leaving sensor areas unprotected to maintain their sensitivity and functionality.
2Strength
If adhesive layer is applied over semiconductor die, then die attachment is secured, but sensor sensitivity may be compromised
Solution Approach 1:
The adhesive layer is applied selectively in specific regions of the substrate rather than uniformly across the entire surface. This localized application provides secure die attachment in areas where structural support is needed while deliberately avoiding sensor regions to preserve their sensitivity and operational reliability. The adhesive is confined to non-critical areas where it provides bonding without interfering with sensor function.
Solution Approach 2:
The substrate surface is segmented into adhesive-covered regions and adhesive-free regions. The adhesive layer is disposed over specific portions of the substrate between conductive posts, creating distinct zones with different functional properties. This segmentation allows the die to be securely attached in supported areas while sensor regions remain exposed and sensitive to their operational environment.
3Object-affected harmful factors
If encapsulant is deposited over semiconductor die, then environmental protection is provided, but sensor access to external stimuli may be restricted
Solution Approach 1:
The encapsulant is deposited to provide environmental protection for the substrate and conductive posts while deliberately leaving sensor regions exposed or with reduced encapsulation. This localized differentiation allows the majority of the device to be protected from environmental harmful factors while sensor areas maintain direct access to external stimuli such as light, heat, or other physical quantities they are designed to detect.
Solution Approach 2:
The encapsulation strategy transitions from complete three-dimensional coverage to a more selective approach where protection is provided in certain spatial dimensions and regions while leaving sensor access paths open. The encapsulant may cover the backside and sides of the substrate while allowing front-side sensor regions to remain accessible to external stimuli, effectively using spatial dimensionality to resolve the contradiction between protection and sensor response.
Data Source
AI summary
A semiconductor device has a substrate including a base and a plurality of conductive posts extending from the base. A semiconductor die is disposed on a surface of the base between the conductive posts. An interconnect structure is formed over the semiconductor die and conductive posts. An adhesive layer is disposed over the semiconductor die. A conductive layer is disposed over the adhesive layer. An encapsulant is deposited over the semiconductor die and around the conductive posts. One or more conductive posts are electrically isolated from the substrate. The conductive layer is a removable or sacrificial cap layer. The substrate includes a wafer-shape, panel, or singulated form. The semiconductor die is disposed below a height of the conductive posts. An interconnect structure is formed over the semiconductor die, encapsulant, and conductive posts.