Sensor Die Redistribution Structure for Exposed Sensing Regions
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving smaller and more creative packaging techniques for semiconductor dies due to limitations in current integration density and packaging methods, particularly in exposing sensing regions for functional operation while maintaining reliability and preventing delamination.
Innovation Solution
The method involves a semiconductor package manufacturing process using a carrier with a release layer and dielectric layer, forming conductive vias, attaching an integrated circuit die, encapsulating with a molding compound, and creating a redistribution structure that exposes the sensing region without covering it, ensuring the sensing region's functionality and structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the sensing region is covered by the redistribution structure, then the structural integrity is improved, but the sensing functionality deteriorates
Solution Approach 1:
The redistribution structure is segmented into different regions: a first region that covers the input/output region for structural support and electrical connection, and a second region that exposes the sensing region for functional operation. This segmentation allows the structure to simultaneously provide mechanical integrity and sensing functionality by spatially separating the coverage areas.
2Ease of operation
If the sensing region is exposed, then the sensing functionality is improved, but the reliability deteriorates due to potential delamination
Solution Approach 1:
The redistribution structure exhibits local quality variation: in the first region, it provides full coverage for structural support and electrical connection, while in the second region, it provides selective exposure of the sensing region. This local differentiation in coverage quality allows the sensing region to remain accessible while maintaining overall structural reliability through the covered input/output regions.
3Productivity
If the minimum feature size is reduced to increase integration density, then the quantity of components is improved, but the manufacturing precision requirements worsen
Solution Approach 1:
The redistribution structure extends in multiple dimensions with different coverage patterns. By utilizing the planar dimension to create distinct first and second regions with different coverage characteristics, the design achieves high integration density while maintaining manufacturability through clear regional differentiation rather than relying solely on minimizing feature sizes.
Data Source
AI summary
A semiconductor package and a manufacturing method for the semiconductor package are provided. The semiconductor package includes a molded semiconductor device, a first redistribution structure, and conductive vias. The molded semiconductor device comprises a sensor die with a first surface and a second surface opposite the first surface, wherein the sensor die has an input/output region and a sensing region at the first surface. The first redistribution structure is disposed on the first surface of the sensor die, wherein the first redistribution structure covers the input/output region and exposes the sensing region, and the first redistribution structure comprises a conductive layer having a redistribution pattern and a ring structure. The redistribution pattern is electrically connected with the sensor die. The ring structure surrounds the sensing region and is separated from the redistribution pattern, wherein the ring structure is closer to the sensing region than the redistribution pattern. The conductive vias extend through the molded semiconductor device and are electrically connected with the redistribution pattern.