Multi-chip Sensor Die with Integrated Temperature Control
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Solution Overview
Problem
Current sensor systems require multiple insertions into environmental test chambers for temperature calibration, leading to increased time and cost due to the need for separate heater and temperature sensor components, which complicates the calibration process and limits production efficiency.
Innovation Solution
Integrating a heating element and temperature sensor on the same semiconductor die as the transducer, allowing for simultaneous temperature trimming at multiple temperatures during a single insertion, and converting analog signals to digital for accurate characterization and calibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate heater and temperature sensor components are used, then temperature calibration can be performed, but calibration time increases and production efficiency is limited
Solution Approach 1:
The patent combines the heater, temperature sensor, and transducer onto a single semiconductor die. This integration allows all temperature calibration measurements to be performed simultaneously on the same device during a single test chamber insertion, eliminating the need for separate calibration steps and significantly reducing calibration time while maintaining measurement accuracy.
Solution Approach 2:
The semiconductor die serves multiple functions: it acts as the transducer for sensing, contains the heater for temperature control, and includes the temperature sensor for measurement. This multi-functionality enables comprehensive temperature calibration to be performed on a single integrated device rather than requiring separate components and multiple test insertions.
2Measurement precision
If separate heater and temperature sensor components are used, then temperature calibration can be performed, but device complexity increases
Solution Approach 1:
The patent merges the heater, temperature sensor, and transducer into a single integrated semiconductor die. This consolidation simplifies the calibration process by reducing the number of separate components that need to be managed, connected, and calibrated individually, thereby reducing overall system complexity while maintaining calibration accuracy.
3Measurement precision
If multiple insertions into test chamber are required, then comprehensive temperature calibration can be achieved, but production capacity is limited
Solution Approach 1:
The patent combines all temperature calibration functionality into a single integrated device that can be calibrated during one test chamber insertion. This eliminates the need for multiple insertions and sequential calibration steps, thereby increasing production capacity by allowing faster throughput while maintaining comprehensive temperature calibration accuracy.
4Measurement precision
If complex trimming procedures are used for temperature compensation, then temperature accuracy can be improved, but manufacturing cost increases
Solution Approach 1:
The patent integrates the temperature sensor and heater directly on the transducer die, enabling temperature compensation and calibration to be performed as part of the standard manufacturing process rather than requiring complex, separate trimming procedures. This integration reduces manufacturing cost by simplifying the production workflow while maintaining temperature accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces calibration time and cost by enabling efficient temperature calibration within a single test chamber insertion, increasing production capacity and simplifying the calibration process while maintaining high accuracy.
Implementation Method 1
The temperature control element can be configured to change a temperature of at least a portion of the transducer die
Data Source
AI summary
A multi-die sensor system comprises a package and one or more transducer dies mounted in the package. Each transducer die includes one or more transducers, a temperature control element, and temperature sensor. The temperature control element changes the temperature of at least a portion of the transducer during operation of the temperature control element. A temperature sensor senses the temperature of at least the portion of the transducer. An output circuitry die mounted in the package receives transducer signals and a sensed temperature signal from the temperature sensor.