Integrated Sensor Display Panel Layout for Larger Viewing Areas
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Solution Overview
Problem
Display devices face challenges in accommodating various sensors such as optical, ultrasonic, and fingerprint sensors, which reduce the available display area for image display.
Innovation Solution
Incorporation of sensor devices into the display panel by using a thin-film transistor layer and emission material layer with specific electrode and semiconductor layer configurations, allowing for integrated light-emitting and light-receiving elements without overlapping with display areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If sensor devices are added to the display device, then functionality is enhanced, but display area is reduced
Solution Approach 1:
The patent merges sensor devices with the display panel by integrating light-receiving elements into the same panel structure. The sensor layer is formed within the display panel using the same thin-film transistor backplane, combining display and sensing functions into a single integrated structure, thereby eliminating the need for separate sensor modules that would occupy additional display area.
Solution Approach 2:
The display panel is designed to perform multiple functions simultaneously: displaying images through light-emitting elements and sensing light through light-receiving elements. The same panel structure, including the thin-film transistor layer and substrate, serves both display and sensor functions, making the display device universal and eliminating the need for separate dedicated sensor areas.
2Area of stationary object
If sensor devices are integrated into the display panel, then display area is enlarged, but manufacturing complexity increases
Solution Approach 1:
The integrated panel is segmented into distinct functional regions: light-emitting elements for display, light-receiving elements for sensing, and bank structures for isolation. Each region is formed through separate but coordinated manufacturing steps, allowing the complex integrated structure to be built systematically using standard thin-film fabrication processes without overwhelming manufacturing complexity.
Solution Approach 2:
The patent uses parameter changes in the manufacturing process, such as varying the thickness and material composition of different layers (emission material layer, sensor layer, bank structures) to achieve the desired dual functionality. By adjusting these parameters during fabrication, the same base structure can be configured for different regions to perform different functions, simplifying the overall manufacturing approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enlarges the display area by integrating sensors within the display panel without reducing the space for image display, enabling wider viewing areas and enhanced functionality.
Implementation Method 1
light-receiving elements each including a first light-receiving electrode, a light-receiving semiconductor layer, and a second light-receiving electrode
Implementation Method 2
light-emitting elements each including a first light-emitting electrode, an emissive layer, and a second light-emitting electrode
Data Source
AI summary
A display device includes a thin-film transistor layer disposed on a substrate and including thin-film transistors; and an emission material layer disposed on the thin-film transistor layer. The emission material layer includes light-emitting elements each including a first light-emitting electrode, an emissive layer and a second light-emitting electrode, light-receiving elements each including a first light-receiving electrode, a light-receiving semiconductor layer and a second light-receiving electrode, and a first bank disposed on the first light-emitting electrode and defining an emission area of each of the light-emitting elements. The light-receiving elements are disposed on the first bank.