Image Sensor Unit Edge Protection for Chip Damage
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Solution Overview
Problem
Existing image sensor units for reading large originals face challenges in preventing damage to sensor chips during connection and storage due to protrusion, which can lead to image missing sections and reduced read quality.
Innovation Solution
The image sensor unit design includes a light source, sensor substrate unit with photoelectric conversion elements mounted beyond the edges of connected sensor substrates, and a supporting body that positions the farthest tips of these elements inside the connection means, preventing chip damage by allowing the substrate edges to absorb impact during handling or storage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensor chips are mounted beyond the edges of sensor substrates to reduce image missing sections, then reading quality is improved, but sensor chips are vulnerable to damage during connection and storage
Solution Approach 1:
The patent applies beforehand cushioning by positioning the photoelectric conversion elements beyond the substrate edges to protrude outward, creating a protective configuration where the elements extend into spaces that would otherwise be vulnerable to impact during connection and storage operations
2Measurement precision
If sensor substrates are connected in series with minimal intervals to reduce image missing sections, then reading quality is improved, but sensor chips become more vulnerable to damage during connection
Solution Approach 1:
The patent applies segmentation by dividing the sensor substrate into multiple separate substrates connected in series, with each substrate containing photoelectric conversion elements that extend beyond its edges. This segmentation allows for modular assembly while maintaining continuous coverage across connection points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents sensor chip damage and maintains high read quality by ensuring the substrate edges absorb any obstacles, thereby protecting the chips and reducing image missing sections.
Implementation Method 1
a light condenser that focuses light from the object to be read on the sensor substrate unit
Implementation Method 2
a plurality of photoelectric conversion elements arranged and mounted in a line in a longitudinal direction
Data Source
AI summary
A sensor substrate unit is formed by connecting edges of a plurality of sensor substrates in a longitudinal direction. Sensor chips at the edges are mounted beyond the edges. The edges include convex portions and convex portions for connecting the sensor substrates. Farthest tips of the sensor chips are positioned inside of farthest edges of the convex portions and inside of farthest edges of the convex portions in the longitudinal direction.