Sensor Device Elastic Buffer for Thermal Stress Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional sensor devices face challenges in minimizing the influence of stress from the casing portion on the sensor portion, which affects detection accuracy due to thermal expansion and adhesive properties.
Innovation Solution
Incorporating an elastic portion with a lower elastic modulus than the casing portion, positioned between the sensor and casing, along with an adhesive, to absorb and reduce stress, while ensuring the elastic portion has higher viscosity than the adhesive for effective stress absorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive is used to connect sensor portion and casing portion, then the sensor device achieves structural integrity and assembly simplicity, but stress from the casing portion is transferred to the sensor portion, affecting detection accuracy
Solution Approach 1:
An elastic portion is introduced as an intermediary component between the adhesive and the sensor portion. This elastic portion acts as a stress-absorbing buffer that prevents stress from the casing portion from being directly transmitted to the sensor portion through the adhesive, thereby protecting detection accuracy while maintaining the structural integrity provided by the adhesive connection.
Solution Approach 2:
The connection structure utilizes a composite arrangement combining adhesive and elastic portion materials. The adhesive provides strong bonding between the casing and sensor assembly, while the elastic portion material provides stress absorption and isolation. This composite approach allows both structural integrity and stress isolation to be achieved simultaneously.
2Strength
If rigid connection is used between casing portion and sensor portion, then structural strength is improved, but stress transfer to sensor portion increases, reducing measurement precision
Solution Approach 1:
The elastic portion serves as a mediator that decouples the rigid connection provided by the adhesive from the sensor portion. While the adhesive maintains strong structural bonding, the elastic portion interrupts the direct stress transmission path, allowing the structure to remain strong while preventing stress-induced measurement errors.
3Measurement precision
If adhesive layer is made thicker to reduce stress transfer, then stress isolation improves, but assembly complexity and manufacturing difficulty increase
Solution Approach 1:
Rather than increasing adhesive thickness, a thin elastic portion is introduced as an intermediary layer. This elastic portion achieves effective stress isolation with minimal thickness, avoiding the increased assembly complexity and manufacturing difficulty that would result from using a thicker adhesive layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the transfer of heat stress from the casing to the sensor, enhancing detection accuracy and maintaining output stability over time by minimizing variations in output due to thermal changes.
Implementation Method 1
an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion
Implementation Method 2
an adhesive that is provided between the sensor portion and the casing portion
Data Source
AI summary
A sensor device including: a sensor portion; a casing portion housing the sensor portion; an elastic portion that is provided in contact with the casing portion between the sensor portion and the casing portion and has a material having smaller elastic modulus than elastic modulus of the casing portion; and an adhesive that is provided between the sensor portion and the casing portion is provided. The adhesive may have an interface between the elastic portion and the adhesive. The elastic portion may have the same material as the adhesive. The elastic portion may have smaller elastic modulus than the adhesive.