Glass Sensor Electrodes With Post-Assembly TGV Metallization
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Solution Overview
Problem
Conventional methods for manufacturing electrochemical sensors are expensive and complex due to the precision alignment requirements of metalized layers, which limits the flexibility and efficiency of electrode fabrication and device assembly.
Innovation Solution
A method for forming a glass electrochemical sensor that eliminates the need for precision alignment of metalized layers by using through glass vias (TGVs) and bottom-up plating to metallize the sensor components post-assembly, allowing for simpler and more reliable electrical connections and increased density of conducting material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If precision alignment of metalized layers is used in conventional electrochemical sensor manufacturing, then electrical connection reliability is improved, but manufacturing complexity and cost increase
Solution Approach 1:
Instead of aligning metalized layers during assembly, the patent inverts the approach by forming through-glass vias (TGVs) through the glass substrate first, then metallizing them after assembly. This eliminates the precision alignment requirement for metalized layers while maintaining electrical connection reliability, directly resolving the technical contradiction between reliability and manufacturing complexity
Solution Approach 2:
The patent performs preliminary actions by forming TGVs through the glass substrate before final assembly, and then metallizing the TGVs after assembly. This preliminary via formation followed by post-assembly metallization allows for simpler alignment during assembly while ensuring reliable electrical connections, addressing both the reliability and complexity concerns
2Reliability
If precision alignment of metalized layers is used in conventional electrochemical sensor manufacturing, then electrical connection reliability is improved, but production yield decreases
Solution Approach 1:
The patent inverts the conventional sequence by forming TGVs first, assembling the sensor, and then metallizing the TGVs. This inversion eliminates precision alignment requirements for metalized layers, thereby increasing production yield while maintaining electrical connection reliability through the TGV structure
Solution Approach 2:
The patent segments the manufacturing process into distinct stages: TGV formation, assembly, and post-assembly metallization. This segmentation allows each stage to be optimized independently, with the metallization stage no longer requiring precision alignment, thus improving production yield while ensuring reliable electrical connections
3Adaptability or versatility
If multiple electrode materials are used in a single sensor, then sensing sensitivity and versatility are improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary TGV formation and assembly before metallization, allowing different electrode materials to be deposited in different TGVs during a single post-assembly metallization process. This preliminary structuring enables multi-material electrodes without requiring separate alignment processes for each material, thus improving sensing versatility while keeping manufacturing complexity manageable
Solution Approach 2:
The TGV structure serves as a universal platform that can accommodate multiple different electrode materials (e.g., gold, platinum, carbon) in different vias. This universal via structure enables the sensor to detect multiple different analytes simultaneously, improving sensing versatility without proportionally increasing manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing complexity and cost, increases the yield of sensor production, and enables the use of multiple electrode materials within a single sensor, enhancing sensitivity and flexibility in device fabrication.
Implementation Method 1
bottom up plating to metallize the sensor components post-assembly
Data Source
AI summary
A method of forming a sensor, such as a glass electrochemical sensor, is described. In some examples, the method may include forming a plurality of apertures in a glass substrate; forming a sensor body comprising the glass substrate and at least one glass sensor component, wherein one or more apertures of the glass substrate are aligned with the at least one glass sensor component to form an outer contact aperture; filling the outer contact aperture in the sensor body with a first conducting material to form an outer contact through glass via (TGV); and forming an electrode on the glass substrate adjacent at least one of the apertures of the plurality of apertures.