Sensor Element with Recessed Optical Sensor and Sealing Member
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Solution Overview
Problem
Existing sensor elements with light emitting semiconductor chips lack effective protection against environmental damage, leading to issues with dust, fluid, and gas ingress, which can compromise the functionality and longevity of both the semiconductor chip and the optical sensor.
Innovation Solution
A sensor element design featuring a light emitting semiconductor chip mounted on a transparent substrate with a recessed optical sensor and a sealing member, such as a metal ring or silicone layer, that creates a hermetically sealed area between the substrate and carrier, reducing direct crosstalk and providing robust protection against environmental factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor chip and optical sensor are exposed to the environment, then the structure remains simple and accessible, but the components are vulnerable to dust, fluid, and gas ingress
Solution Approach 1:
The optical sensor is nested within a recess of the carrier, and the semiconductor chip is nested within a recess of the substrate. This nesting approach provides protection against environmental damage while maintaining a compact and relatively simple overall structure, as the protective features are integrated into the existing components rather than adding separate external enclosures.
Solution Approach 2:
A sealing member, such as a metal ring or silicone layer, is introduced to create a hermetically sealed area between the substrate and carrier. This sealing member acts as a flexible barrier that protects the semiconductor chip and optical sensor from dust, fluid, and gas ingress while allowing for manufacturing tolerances and thermal expansion.
2Reliability
If the substrate is made transparent to allow light transmission, then light can reach the optical sensor, but direct crosstalk from the semiconductor chip to the optical sensor increases
Solution Approach 1:
The substrate is segmented by introducing a recess that partially removes material in the path between the semiconductor chip and optical sensor. This segmentation allows light to pass through transparent areas while blocking direct crosstalk through the recessed areas, effectively separating the useful light path from the harmful direct path.
Solution Approach 2:
The substrate exhibits different optical properties in different locations: transparent in areas where light transmission is needed, and opaque or recessed in areas where crosstalk blocking is needed. This local differentiation of optical quality allows simultaneous achievement of light transmission and crosstalk reduction.
3Length of moving object
If the optical sensor is placed at the same level as the semiconductor chip, then the structure remains simple, but the sensor element height increases
Solution Approach 1:
Instead of positioning the optical sensor at the same vertical level as the semiconductor chip (horizontal arrangement), the sensor is placed in a recess that extends in the vertical dimension. This dimensional change allows the sensor to be optically isolated from the chip while maintaining a compact overall height, as the recess utilizes the vertical space already available in the component stack.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the semiconductor chip and optical sensor from environmental damage, enhances sealing stability, and reduces direct light interference, resulting in a compact, long-lasting, and robust sensor element suitable for various light types, including UV radiation.
Implementation Method 1
The semiconductor chip is embodied to generate electromagnetic radiation... The electromagnetic radiation may comprise visible light, infrared light or ultraviolet light
Implementation Method 2
The substrate is transparent for the radiation of the semiconductor chip
Implementation Method 3
an optical sensor for receiving light of the semiconductor chip that is reflected by an object
Implementation Method 4
the carrier is made of not transparent material that absorbs light of the semiconductor chip. Therefore, direct crosstalk from the semiconductor chip to the optical sensor is reduced
Data Source
AI summary
A sensor element is disclosed. In an embodiment a sensor element includes a substrate, a light emitting semiconductor chip arranged with a mounting face on a mounting face of the substrate, wherein the semiconductor chip has a smaller mounting face than the substrate, wherein a border area of the mounting face of the substrate circumvents the semiconductor chip, wherein on a bottom side of the semiconductor chip electrical contacts are arranged, and wherein the substrate is transparent for radiation of the semiconductor chip, a carrier, wherein the bottom side of the semiconductor chip is arranged on a mounting face of the carrier, wherein the carrier includes further electrical contacts on the mounting face, and wherein the contacts of the semiconductor chip and the further contacts of the carrier are connected, a sealing member arranged between the mounting face of the carrier and the border area of the substrate, wherein the sealing member seals a sealing area between the substrate and the carrier, wherein a recess is arranged in the mounting face of the carrier, and an optical sensor arranged in the recess.