Semiconductor Optical Sensor With Frame Layer Via Reinforcement
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Solution Overview
Problem
Existing semiconductor devices face challenges in integrating optical sensors with thin film filters and through-substrate vias while maintaining mechanical stability and reducing package height for advanced optical applications.
Innovation Solution
A semiconductor device design featuring a sensor on a substrate with a through-substrate via and a frame layer above the via, where the filter is positioned either above or within a recess in the substrate, and a method involving partial removal of the semiconductor body to form the via and accommodate the filter, ensuring mechanical stability and thin package height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-substrate vias are formed to connect sensor to external contacts, then electrical connectivity is improved, but mechanical stability deteriorates due to substrate thinning
Solution Approach 1:
The frame layer is nested within the recess of the semiconductor substrate, creating a reinforced structure where the frame layer fills and strengthens the area around the through-substrate via opening, preventing substrate collapse while maintaining electrical connectivity
Solution Approach 2:
The device combines the semiconductor substrate material with the frame layer material to create a composite structure that provides both electrical connectivity through the via and mechanical strength through the frame layer reinforcement
2Reliability
If filter layer is applied on glass sheet with same dimensions as wafer, then filter coverage is improved, but package height increases beyond initial wafer thickness
Solution Approach 1:
Instead of extending the filter laterally beyond the wafer edges (horizontal dimension), the filter is positioned vertically within the recess of the substrate, utilizing the vertical dimension to achieve full coverage while maintaining a compact package height
Solution Approach 2:
The filter layer is nested within the recess structure of the substrate, allowing the filter to be accommodated within the existing substrate volume rather than adding external height to the package
3Length of stationary object
If wafer is thinned to reduce package height, then package compactness is improved, but mechanical stability deteriorates
Solution Approach 1:
The frame layer is nested in the recess to provide localized mechanical reinforcement at the critical via opening area, allowing the rest of the substrate to remain thin for compact packaging while maintaining overall structural integrity
Solution Approach 2:
The frame layer provides localized mechanical reinforcement specifically at the via opening region where stress concentration occurs, while the rest of the substrate maintains its thinned configuration for compactness
Data Source
AI summary
A sensor (2) is arranged at a main surface (10) of a semiconductor substrate (1), and a filter (3) is arranged above the sensor. A through-substrate via (4) penetrates the substrate outside the region of the sensor. A semiconductor body is applied above the main surface and then partially removed at least in an area above the sensor. A portion of the semiconductor body remains above the through-substrate via as a frame layer (5). The filter is on a level with the frame layer.