Sensor-Guided Substrate Separation for Precise Bonded Wafer Entry

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Solution Overview

Problem

Large and thin substrates, such as wafers, are prone to warping and damage during transfer and polishing processes, necessitating a precise method to separate carrier substrates from device substrates without causing further damage.

Innovation Solution

A substrate separation apparatus equipped with a sensor module and processor to accurately measure distances and detect damage, allowing a separation member to enter at a controlled height to form a crack, preventing damage by monitoring the blade's condition and adjusting its entry point.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a separation member enters a bonded portion to separate substrates, then productivity is improved through rapid separation, but the substrate may be damaged due to imprecise entry positioning

Engineering Contradiction:

Improvesubstrate separation speedVSAvoidentry position accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The system performs preliminary actions by measuring the height of the bonded portion and calculating the step difference before the separation member enters. The processor determines the exact entry position in advance based on sensor data, ensuring the separation member can enter precisely at the bonded portion without damaging the substrates, thereby enabling rapid and accurate separation

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system uses a sensor to measure the actual height of the bonded portion and provides feedback to the processor. The processor calculates the step difference between the bonded portion and the separation member, and adjusts the entry position accordingly. This closed-loop feedback mechanism ensures precise positioning while maintaining high separation speed

Inventive Principle:

Principle #23Feedback

2Productivity

If the separation member enters at high speed for rapid separation, then work speed is improved, but damage to the entry surface increases

Engineering Contradiction:

Improvework speedVSAvoidentry surface damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The system performs preliminary measurement of the bonded portion height and calculates the precise entry position before the separation member contacts the substrate. By determining the exact entry point in advance based on sensor feedback, the system enables high-speed separation while minimizing impact damage to the entry surface

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system dynamically adjusts the entry position parameter based on real-time sensor measurements of the bonded portion height. The processor calculates the step difference and modifies the entry depth parameter to match the actual bonded portion depth, allowing high-speed operation while preventing excessive penetration that would cause surface damage

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS20260001312A1Substrate separation apparatus and control method thereof

Publication Date: 2026.01.01 ZEUS

AI summary

The present invention relates to a substrate separation apparatus, and the substrate separation apparatus includes a separation member (310) that enters a bonded portion (12) of a bonded substrate (10) in which a first substrate (11) and a second substrate (13) are bonded, and forms a crack, a sensor module (200) configured to photograph the bonded substrate (10) and the separation member (310) to obtain measurement values corresponding to distances from the sensor module (200) to the bonded substrate (10) and the separation member (310), and a processor (100) configured to move the separation member (310) to a height of the bonded portion (12) on the basis of the measurement values.