Modular Sensor Head Sealing for Flexible Housing Design
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Solution Overview
Problem
Existing sensor unit manufacturing methods integrate sealing and housing design into a single process, limiting design variance and requiring complex tooling for different applications, and expose sensors to mechanical and thermal stresses during molding.
Innovation Solution
Decouple the sealing function from the housing design by using a potting compound with lower processing pressures and temperatures to form a sensor head separate from the housing, allowing modular manufacturing and standardized sealing processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sealing and housing design are integrated into a single injection molding process, then the manufacturing process is simplified, but design variance is limited and complex tooling is required for different applications
Solution Approach 1:
The patent divides the manufacturing process into two separate injection molding steps: first molding the housing, then molding the sealing component. This segmentation allows each component to be optimized independently, enabling design variance in the housing while maintaining standardized sealing processes, thus resolving the contradiction between manufacturing simplicity and design adaptability.
Solution Approach 2:
The sealing function is extracted from the integrated housing design and implemented as a separate injection-molded component. This extraction allows the sealing process to be standardized and decoupled from housing design variations, enabling flexible housing designs for different applications without requiring complex retooling.
2Productivity
If sealing and housing design are integrated into a single injection molding process, then fewer manufacturing steps are required, but tooling complexity increases for different applications
Solution Approach 1:
The manufacturing process is segmented into two sequential injection molding steps with standardized interfaces. The first step produces the housing, and the second step produces the sealing component that attaches to the housing. This segmentation reduces tooling complexity by using standardized sealing components across different applications, even though it adds a manufacturing step.
3Strength
If high pressure and temperature injection molding is used for housing, then the housing structure is strong, but sensors are exposed to mechanical and thermal stresses
Solution Approach 1:
The housing is molded first and allowed to cool and stabilize before the sensor-containing sealing component is molded. This preliminary action ensures the housing is structurally stable before sensors are introduced, protecting them from thermal stresses. The two-step process separates the high-stress housing formation from the sensor-containing component formation.
Solution Approach 2:
By separating the housing and sealing component into different molding steps, the patent protects sensors from the high pressure and temperature conditions required for strong housing structures. The sensors are only present during the second, lower-stress sealing component molding process.
4Ease of manufacture
If standardized sealing components are used across different applications, then tooling costs are reduced, but customization flexibility may be limited
Solution Approach 1:
The sealing component is designed as a universal standardized part that can be used across different sensor applications. The standardized interface between the sealing component and housing allows the same sealing component to accommodate different sensor types and configurations, reducing tooling costs while maintaining customization flexibility through the modular housing designs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible housing designs for various applications, reduces tooling costs, and protects sensors from excessive mechanical and thermal stresses, while ensuring a media-tight seal.
Implementation Method 1
The connection between the potting compound and the housing can be based on the exploitation of adhesion
Implementation Method 2
The connection between the potting compound and the housing can be based on the exploitation of adhesion, bipolar forces or covalent bonds
Implementation Method 3
An injection-molded housing made of a plastic material specifies an outer shape of the sensor unit
Implementation Method 4
The potting compound of the sensor head consists of a material which can be processed at lower pressures and/or temperatures than the plastic material of the housing
Data Source
AI summary
A sensor unit includes at least one sensor and at least two busbars. The busbars have first ends forming an internal electric interface for contacting the sensor and second ends forming an external electric interface for a connection cable or a plug receiving area. An injection-molded plastic housing defines the outer shape of the sensor unit and forms a sensor receiving area with a through-opening, which holds the sensor. The housing partly encases the busbars such that the internal electric interface is at least partly free and accessible near the sensor receiving area and the external electric interface is formed within the housing. The sensor and the internal electric interface are surrounded by a potting compound in a media-tight manner to form a sealed sensor head. The potting compound is formed of a material that can be processed at lower pressures and/or temperatures than the plastic material of the housing.