Temperature Sensor Head with Segmented Encapsulation
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Solution Overview
Problem
Thermometers with encapsulated temperature sensors have slower response times and lower mechanical stability compared to those with soldered sensors, and are not suitable for high temperatures.
Innovation Solution
An apparatus with a sensor head partially filled with a first material for mechanical stabilization and a second material with high thermal conductivity for improved heat transfer, allowing for faster response times and enhanced mechanical stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the temperature sensor is encapsulated in ceramic powder or ceramic potting compound, then mechanical stability and insulation are improved, but response time deteriorates
Solution Approach 1:
The encapsulation material is segmented into two distinct functional zones: a first ceramic material (e.g., aluminum oxide, magnesium oxide) providing mechanical stability and electrical insulation, and a second thermally conductive material (e.g., aluminum nitride, boron nitride, metal powder) providing rapid heat transfer. This segmentation allows each material to optimize its specific function without compromise.
Solution Approach 2:
Different regions of the encapsulation have different material properties tailored to local requirements: the first ceramic material provides structural support and insulation where needed, while the second thermally conductive material is placed in regions requiring efficient heat transfer from the sensor element to the measurement point.
2Loss of time
If the resistance element is soldered to the sensor head, then response time is improved, but suitability for high temperatures deteriorates
Solution Approach 1:
The sensor element is mounted directly on the inner floor of the sensor head without soldering, using the first ceramic material as an intermediary mounting substance. This eliminates the solder joint which limits temperature application, while the ceramic material provides both mechanical support and thermal conduction capabilities.
3Loss of time
If the sensor head is filled with thermally conductive material, then response time is improved, but mechanical stability deteriorates
Solution Approach 1:
The encapsulation uses a composite structure combining two different materials: the first ceramic material provides mechanical stability, structural support, and electrical insulation, while the second thermally conductive material provides rapid heat transfer. Together they form a composite system that achieves both mechanical strength and thermal performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves significantly improved response times and mechanical stability, enabling effective temperature monitoring at high temperatures while maintaining mechanical integrity.
Implementation Method 1
at least partially with at least one, second material (11) for heat conduction within the sensor head (3)
Data Source
AI summary
The present disclosure relates to an apparatus for determining and/or monitoring temperature of a liquid. The apparatus includes at least one temperature sensor arranged in a sensor head. Furthermore, the present disclosure relates to a method for manufacturing the apparatus. At least one internal volume of the sensor head is at least partially filled with at least one first material and at least one second material. The first material serves for affixing at least one component of the temperature sensor within the sensor head, and the second material serves for heat conduction within the sensor head.