Sensor Holder Flange Design for Image Pickup Apparatus
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Solution Overview
Problem
The existing image pickup apparatuses face issues with imaging sensor packages peeling off from the sensor holder during reflow mounting to a circuit board, and the increased mounting area due to exposed terminals in SOP structures, as well as the size constraints caused by screw projections in flat plate sensor holders.
Innovation Solution
A sensor holder with flange portions projecting towards the heat radiation plate is used, allowing for secure positioning and adherence of the imaging sensor package to the lens barrel without protrusions, enabling reflow mounting and reducing the lens barrel's size by eliminating the need for forward screw holes, and using a heat radiation rubber plate for thermal connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the imaging sensor package is adhered by adhesive to the sensor holder and reflow mounted to a circuit board, then the mounting process is efficient and automated, but the sensor package is peeled off from the sensor holder
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the sensor holder at positions corresponding to the adhesive application areas. These recesses are created before the adhesive bonding process, allowing the adhesive to be contained within specific boundaries. This preliminary structural preparation prevents the adhesive from spreading to unwanted areas (such as the protection glass plate) and ensures proper bonding between the sensor package and sensor holder during reflow mounting, thereby maintaining both mounting efficiency and bonding reliability.
2Reliability
If screw holes are formed in the sensor holder for mounting to the lens barrel, then the sensor holder can be securely fixed, but the lens barrel size increases due to required projections
Solution Approach 1:
The patent applies inversion by reversing the conventional approach: instead of forming screw holes in the sensor holder that require projections extending toward the object, the recesses are formed in the sensor holder body itself at its rear surface or side surfaces. This inverted design allows the sensor holder to be securely fixed to the lens barrel through adhesive bonding in the recesses, eliminating the need for protruding structures and thereby reducing the lens barrel size while maintaining fixing strength.
3Reliability
If adhesive is applied to the sensor holder for bonding the sensor package, then the sensor package can be attached, but the adhesive adheres to the protection glass plate causing defects
Solution Approach 1:
The patent applies local quality by creating recesses at specific localized positions in the sensor holder where adhesive is intended to be applied. These recesses are positioned away from the protection glass plate area. By confining the adhesive to these specific local regions, the patent ensures proper sensor package attachment while preventing adhesive from spreading to and contaminating the protection glass plate, thus eliminating the harmful effect of adhesive contamination.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures reliable attachment of the imaging sensor package to the lens barrel, reduces the lens barrel's size, and allows for efficient heat dissipation while preventing adhesive from adhering to the protection glass plate, thus enhancing the structural integrity and thermal management of the image pickup apparatus.
Implementation Method 1
a heat radiation rubber plate for thermal connection
Data Source
Figure 1A~1C
Figure 2A~2B
Figure 3A~3B
AI summary
An image pickup apparatus in which an imaging sensor package reflow mounted in advance to a circuit board can be fixed to a fixture member of the image pickup apparatus. A sensor holder (20) of a digital video camera (1) as an image pickup apparatus has a holder body (21) that is positioned to surround an imaging sensor package (15) mounted to a sensor board (16) as a circuit board. Flange portions (31) of the sensor holder (20) are formed to project from a rear end surface of the holder body (21) toward a heat radiation plate (25) having a flat plate shape. The heat radiation plate (25) is fixed to a lens barrel (10) in a state that the flange portions (31) are held between the lens barrel (10) and the heat radiation plate (25).