Sensor Housing Heat Sink Radial Dissipation Thermal Isolation

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Solution Overview

Problem

LED luminaires face challenges in thermal management, as sensors and components generate heat, leading to potential damage and performance degradation, especially when temperatures exceed 85°C, and thermal energy can induce noise in sensors.

Innovation Solution

The integration of a heat sink within sensor housings and modules that are thermally isolated from other heat-generating components in the luminaire, using structures like fins, projections, and tabs for effective heat dissipation and insulation, maintaining sensor temperatures between 25-85°C or closer to ambient temperature.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If sensors and heat-generating components are integrated in the same luminaire, then device functionality is improved, but temperature increases and sensor reliability deteriorates

Engineering Contradiction:
Improvedevice functionalityVSAvoidsensor reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The luminaire is segmented into distinct thermal zones: a first heat sink for LED heat dissipation, a second heat sink for driver component heat dissipation, and a third heat sink for sensor heat dissipation. These heat sinks are thermally isolated from each other, allowing each component to operate in its optimal temperature range while maintaining integrated functionality within the same luminaire housing.

Inventive Principle:
Principle #1Segmentation

2Temperature

If heat sink structures are added to dissipate sensor heat, then temperature control is improved, but device complexity increases

Engineering Contradiction:
Improvesensor temperature controlVSAvoidheat sink structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The sensor housing structure is merged with the third heat sink, integrating the sensor mounting function and heat dissipation function into a single unified component. This eliminates the need for separate sensor housing and heat sink parts, reducing assembly complexity while maintaining effective thermal management for the sensor.

Inventive Principle:
Principle #5Merging (Combining)

3Stability of the object's composition

If thermal isolation structures are implemented, then sensor temperature stability is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvesensor temperature stabilityVSAvoidmanufacturing complexity
Core Design Contradiction:
Stability of the object's compositionVSEase of manufacture

Solution Approach 1:

Thermal isolation structures (such as thermal barriers or insulating materials) are implemented as intermediary elements between the heat-generating components (LEDs and drivers) and the sensor. These intermediaries block thermal pathways while allowing the sensor housing with integrated heat sink to be manufactured using standard processes, balancing thermal stability with manufacturing ease.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively dissipates heat from sensors, prevents damage, and reduces noise-induced performance issues, ensuring reliable operation of sensors within LED luminaires even at elevated temperatures.

Implementation Method 1

a heat sink in thermal communication with the housing. The heat sink is configured to dissipate heat from the sensor and/or associated electronics

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The heat sink can employ any number and design of heat dissipating structures including, but not limited to, fins, projections, tabs, splines, tines, pins, needles, or steps or any combination thereof

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

the sensor housing and integrated heat sink are thermally isolated from the other heat generating elements in the luminaire

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Data Source

PatentUS11290621B2Sensor housings, modules, and luminaires incorporating the same comprising a heat sink with heat dissipation structures radially arranged over the outer wall of a sensor housing
Publication Date: 2022.03.29 LED-IP MANAGEMENT LLC
  • US11290621B2 patent drawing
  • US11290621B2 patent drawing
  • US11290621B2 patent drawing

AI summary

Sensor housings, modules, and luminaires comprising the same are provided. The sensor housings and modules set forth herein have improved heat sinking abilities for dissipating heat from a sensor while simultaneously facilitating thermal isolation of the sensor. Briefly, a sensor housing described herein comprises a cavity for housing a sensor and a heat sink. The heat sink is configured to dissipate heat from the sensor housing and thermally isolate the sensor housing from other heat generating components, such as other portions of a luminaire.