Integrated Sensor Housing for Leak-Tight Media Connections
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Solution Overview
Problem
Existing connecting devices for media lines suffer from complex manufacturing processes and poor integration of sensor elements, leading to potential leaks and inefficient temperature measurement due to the use of multiple parts and thermally conductive materials with different expansion coefficients.
Innovation Solution
A connecting device with a sensor element embedded in thermally conductive plastic material, cohesively connected to the housing, ensuring a tight seal and efficient heat transfer, using a two-component housing where one component is thermally conductive and the other is not, allowing for a compact design with reduced parts and improved mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a sensor element is integrated into a housing using traditional multi-part construction with thermal paste and metal caps, then temperature measurement functionality is achieved, but the manufacturing process becomes complex and integration reliability decreases
Solution Approach 1:
The patent merges the sensor element, thermal conduction path, and housing into a single integrated component. The sensor element is directly embedded in the housing with its backside forming part of the housing structure, eliminating the need for separate metal caps and thermal paste applications. This integration simplifies the manufacturing process while maintaining temperature measurement functionality.
Solution Approach 2:
The patent employs composite material construction where the housing is made from a material with thermal conductivity of at least 0.5 W/(m·K), combining structural integrity with thermal conduction properties. This allows the housing itself to serve as the thermal conduction path to the sensor element, replacing the need for separate thermal conduction components.
2Adaptability or versatility
If different materials with different thermal expansion coefficients are used for the housing and sensor element, then functional requirements are met, but leakage paths may occur due to thermal expansion mismatches
Solution Approach 1:
By making the sensor element backside an integral part of the housing structure, the patent eliminates interfaces between dissimilar materials. The sensor element and housing form a unified structure that expands and contracts together during temperature changes, preventing leakage paths that would occur at material interfaces.
Solution Approach 2:
The patent specifies that the housing material must have a thermal conductivity of at least 0.5 W/(m·K), changing the thermal parameter of the housing material to ensure adequate thermal conduction while maintaining structural integrity and compatibility with the sensor element.
3Strength
If the sensor element is surrounded by non-thermally conductive plastic material, then mechanical strength and sealing are improved, but temperature measurement response time increases and accuracy decreases
Solution Approach 1:
The patent applies different material properties to different regions of the housing. The area surrounding the sensor element is made thermally conductive (≥0.5 W/(m·K)) to enable fast temperature response, while other portions of the housing can use standard thermally insulating materials for mechanical strength and sealing purposes.
Solution Approach 2:
The thermally conductive housing material acts as an intermediary between the medium and the sensor element, efficiently transferring thermal energy from the medium to the sensor while the housing structure provides mechanical protection and sealing.
4Ease of operation
If multiple separate components are used for the measuring device (carrier element, cap, sensor, thermal paste), then assembly flexibility is maintained, but the overall device size increases and compact integration is prevented
Solution Approach 1:
The patent combines the carrier element, sensor element, and housing into a single integrated component. The sensor element is directly embedded in the housing with its backside forming part of the housing structure, eliminating the need for separate caps, carriers, and thermal paste layers, thus achieving compact integration.
Solution Approach 2:
The housing serves multiple functions simultaneously: it provides mechanical protection, creates the sealing structure, conducts thermal energy to the sensor, and serves as the mounting structure for the sensor element. This multi-functionality eliminates the need for separate components for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, leak-proof design with fast response times and accurate temperature measurement by ensuring the sensor element is securely integrated within a thermally conductive material, minimizing temperature offsets and pressure losses, while maintaining mechanical integrity.
Implementation Method 1
the sensor element of the measuring device is received in a form-fitting and/or force-fitting and/or material-fitting manner in a thermally conductive plastic material tightly relative to the medium flowing or flowable through the medium channel
Implementation Method 2
at least one plastic material of the housing is not or only slightly thermally conductive and at least a second plastic material of the housing is thermally conductive
Data Source
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AI summary
In a connection device (1) for connecting at least two media conduits or for connecting one media conduit to an assembly, wherein the connection device (1) comprises a housing (10) with at least one inner medium channel (13) through which medium can flow, and at least one measurement device (2) with a sensor element (23) for determining at least one parameter of the medium, such as the temperature of the medium, the sensor element (23) of the measurement device (2) is received with a form fit and/or force fit and/or cohesive fit in a conductive material, sealingly with respect to the medium that flows or is able to flow through the medium channel (13), and the conductive material is connected with an integral bond to the adjacent material (17) of the housing (10) of the connection device (1), wherein the part of the measurement device (2) provided with the conductive material and/or the part of a wall (115, 215, 317) of the housing (10) of the connection device (1) delimiting the medium channel protrudes into the medium channel (13), and the medium can or does flow at least partially around it.