Sensor Signal IC Temperature Control for Stable Impedance Measurement

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Solution Overview

Problem

Integrated circuits used in sensors are prone to temperature-induced disturbances that affect impedance measurements, leading to inaccurate readings due to changes in resistance, inductance, or capacitance, particularly in compact and cost-effective CMOS technology-based ASICs.

Innovation Solution

An integrated circuit with a temperature-control device for open- or closed-loop temperature and temperature distribution management, utilizing temperature sensors, heating/cooling elements, and switching devices to maintain a stable operating point, especially for electronic components within the circuit.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If integrated circuits are used in compact CMOS technology for sensor signal processing, then device compactness and cost-effectiveness are improved, but temperature stability and measurement precision deteriorate due to higher temperature coefficients of circuit components

Engineering Contradiction:
Improvedevice compactnessVSAvoidmeasurement precision
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

A temperature control device is introduced as an intermediary component between the integrated circuit and the environment. This device includes temperature sensors that monitor the circuit temperature and heating/cooling elements that actively adjust the temperature, thereby mediating the thermal environment to maintain measurement precision despite the compact CMOS design's inherent temperature sensitivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the temperature parameter of the integrated circuit from an uncontrolled variable to a controlled parameter. By actively regulating temperature within a specified range using the temperature control device, the system maintains stable impedance measurements despite external temperature variations, effectively decoupling measurement precision from ambient temperature conditions

Inventive Principle:
Principle #35Parameter changes

2Volume of moving object

If integrated circuits are used in compact CMOS technology for sensor signal processing, then device compactness and cost-effectiveness are improved, but temperature stability deteriorates due to higher temperature coefficients of circuit components

Engineering Contradiction:
Improvedevice compactnessVSAvoidtemperature stability
Core Design Contradiction:
Volume of moving objectVSStability of the object's composition

Solution Approach 1:

A temperature control device is introduced as an intermediary component between the integrated circuit and the environment. This device includes temperature sensors that monitor the circuit temperature and heating/cooling elements that actively adjust the temperature, thereby mediating the thermal environment to maintain measurement precision despite the compact CMOS design's inherent temperature sensitivity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The invention changes the temperature parameter of the integrated circuit from an uncontrolled variable to a controlled parameter. By actively regulating temperature within a specified range using the temperature control device, the system maintains stable impedance measurements despite external temperature variations, effectively decoupling measurement precision from ambient temperature conditions

Inventive Principle:
Principle #35Parameter changes

3Measurement precision

If temperature control device is added to stabilize temperature, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvemeasurement precisionVSAvoiddevice complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The temperature control device is merged with the integrated circuit substrate, with temperature sensors and heating/cooling elements directly integrated onto the same chip. This integration approach reduces the need for separate discrete components and interconnections, thereby minimizing the increase in device complexity while maintaining the temperature stabilization function

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated circuit incorporates self-diagnostic and self-regulation capabilities through integrated temperature sensors that continuously monitor the circuit temperature. The system automatically adjusts its thermal state using on-chip heating or cooling elements controlled by temperature-dependent circuitry, enabling the device to self-regulate without external intervention

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution ensures precise measurements by stabilizing temperature fluctuations, reducing the impact of ambient temperature changes to less than 0.3°C within the IC and external components, thereby enhancing measurement accuracy and robustness.

Implementation Method 1

The circuit has electronic components and is part of an oscillating circuit... temperature sensors... to maintain a stable operating point

Methodology Applied
Scientific EffectTemperature sensing: Thermistor

Implementation Method 2

heating/cooling elements... to maintain a stable operating point

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Implementation Method 3

heating/cooling elements... to maintain a stable operating point

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250377217A1Integrated circuit for signal processing of a sensor and method for the open or closed loop controlling of a temperature or of a temperature distribution in the circuit
Publication Date: 2025.12.11 MICRO EPSILON MESSTECHNIK GMBH & CO KG
  • US20250377217A1 patent drawing
  • US20250377217A1 patent drawing
  • US20250377217A1 patent drawing

AI summary

With respect to particularly accurate measurements even at changing temperatures with structurally simple means, an integrated circuit for signal processing of a sensor, wherein the sensor is an inductively working sensor or an eddy current sensor and wherein the circuit has electronic components and is part of an oscillating circuit, is characterized by a temperature-control device for the open- or closed-loop controlling of a temperature and/or of a temperature distribution in the circuit and/or in at least one electronic component of the circuit. Furthermore, a method is specified for the open- or closed-loop controlling of a temperature or of a temperature distribution in the circuit or in at least one electronic component of the circuit, wherein recorded temperature measurement values are compared to a specified target value for the temperature and wherein in the event of a deviation from the target value, the temperature or temperature distribution is controlled in an open- or closed-loop manner towards the target value.