Sensor Device With Inductors Eliminates Magnetic Cores
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Solution Overview
Problem
Existing sensor devices for measuring electric power require magnetic cores, which increase size and cost, and coreless designs that embed Hall ICs do not sufficiently reduce costs.
Innovation Solution
A sensor device structure featuring semiconductor devices with inductors mounted on a circuit board, where interconnect lines are arranged in parallel with the power line, allowing for enhanced sensitivity without magnetic cores and eliminating the need for embedded ICs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a magnetic core is used in the sensor device, then sensitivity to the power line is enhanced, but the size and cost of the sensor increase
Solution Approach 1:
The patent removes the magnetic core from the sensor device structure, extracting the problematic component that caused increased size and cost. The invention achieves sensitivity enhancement through alternative means: by positioning the coil directly around the power line and using a compact printed circuit board design, the sensor maintains measurement precision without relying on a magnetic core.
Solution Approach 2:
The patent replaces the mechanical magnetic core structure with an electromagnetic field-based detection system. Instead of using a physical magnetic core to concentrate and guide magnetic flux, the invention uses a coil winding configuration and electronic signal processing to detect current, substituting mechanical magnetic concentration with electromagnetic induction and electronic measurement.
2Measurement precision
If a magnetic core is used in the sensor device, then sensitivity to the power line is enhanced, but the cost of the sensor increases
Solution Approach 1:
The patent removes the magnetic core from the sensor device structure, extracting the problematic component that caused increased size and cost. The invention achieves sensitivity enhancement through alternative means: by positioning the coil directly around the power line and using a compact printed circuit board design, the sensor maintains measurement precision without relying on a magnetic core.
Solution Approach 2:
The patent employs inexpensive printed circuit board materials and standard coil winding techniques instead of costly magnetic core components. The invention uses readily available PCB substrates, copper traces, and conventional winding methods, replacing expensive specialized magnetic materials with cost-effective standard electronics components that achieve the same sensing function.
3Device complexity
If a hall IC is embedded in the multilayer printed circuit board, then the magnetic core requirement is eliminated, but the cost reduction is insufficient
Solution Approach 1:
The patent removes the magnetic core from the sensor device structure, extracting the problematic component that caused increased size and cost. The invention achieves sensitivity enhancement through alternative means: by positioning the coil directly around the power line and using a compact printed circuit board design, the sensor maintains measurement precision without relying on a magnetic core.
Solution Approach 2:
The patent employs inexpensive printed circuit board materials and standard coil winding techniques instead of costly magnetic core components. The invention uses readily available PCB substrates, copper traces, and conventional winding methods, replacing expensive specialized magnetic materials with cost-effective standard electronics components that achieve the same sensing function.
4Measurement precision
If the interconnect line is arranged in parallel with the power line and close to the inductor, then sensitivity is improved, but the risk of electrical interference increases
Solution Approach 1:
The patent introduces the circuit board substrate as an intermediary layer between the power line and the interconnect line. The PCB material acts as a dielectric barrier that electrically isolates the high-voltage power line from the low-voltage sensing circuitry, allowing close physical proximity for magnetic coupling while preventing direct electrical interference and ground loops.
Solution Approach 2:
The patent replaces the mechanical magnetic core structure with an electromagnetic field-based detection system. Instead of using a physical magnetic core to concentrate and guide magnetic flux, the invention uses a coil winding configuration and electronic signal processing to detect current, substituting mechanical magnetic concentration with electromagnetic induction and electronic measurement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the cost of sensor devices while maintaining or improving sensitivity by shortening distances between inductors and interconnect lines, and avoiding the cost of magnetic cores.
Implementation Method 1
A change in the amount of current flowing through the power line makes a change in the strength of the magnetic field generated from the power line. Electric power is generated in the inductors in accordance with the change in the magnetic field strength.
Data Source
AI summary
This invention provides a sensor device at reduced cost. The sensor device includes a printed circuit board, a first terminal, a second terminal, an interconnect line, and a semiconductor device. The first terminal and second terminal are provided on the printed circuit board and coupled to a power line. The second terminal is coupled to a downstream part of the power line with respect to the first terminal. The interconnect line is disposed on the printed circuit board to couple the first terminal and second terminal to each other. In other words, the interconnect line is coupled to the power line in parallel. The semiconductor device is mounted on the printed circuit board and includes an interconnect layer and an inductor formed in the interconnect layer.