Sensor Interconnect Using Metalized Carrier Film to Reduce Acoustic Attenuation

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Solution Overview

Problem

Existing piezo electric sensors for blood flow measurement and ultrasound imaging face reduced sensitivity and distortion due to soldering wires and soldering material, which also limit transducer resonance performance and acoustic pressure output.

Innovation Solution

A sensor with an interconnect comprising a metalized carrier film and/or wire, which provides an electrical connection without compromising acoustic properties, by using a thin metalized PET carrier film or wires with a metallic layer, such as gold, to reduce space and attenuation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If soldering wires and soldering material are used for electrical connection, then electrical connection is achieved, but sensor sensitivity and acoustic pressure output are reduced

Engineering Contradiction:

Improveelectrical connectionVSAvoidsensor sensitivity

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

The patent extracts and removes the soldering material from the transducer front surface, replacing it with a solderless wire bonding technique. This eliminates the harmful soldering material that was covering a substantial part of the front surface and degrading acoustic performance, while still achieving reliable electrical connection through the wire bonding process.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a thin carrier film as an intermediary element between the wire and the transducer surface. This carrier film allows the wire to be bonded to the front surface without requiring extensive soldering material, thereby maintaining electrical connection while preserving acoustic properties.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If soldering material is applied on transducer front surface, then electrical connection is achieved, but transducer resonance performance is limited

Engineering Contradiction:

Improveelectrical connectionVSAvoidtransducer resonance performance

Core Design Contradiction:

ReliabilityVSPower

Solution Approach 1:

The patent removes the soldering material from the transducer front surface and replaces it with a solderless wire bonding technique. This extraction eliminates the harmful effect of soldering material on transducer resonance performance while maintaining electrical connection through the wire bonding process.

Inventive Principle:

Principle #2Taking out (Extraction)

3Reliability

If soldering material is applied on transducer front surface, then electrical connection is achieved, but acoustic pressure output is reduced

Engineering Contradiction:

Improveelectrical connectionVSAvoidacoustic pressure output

Core Design Contradiction:

ReliabilityVSQuantity of substance

Solution Approach 1:

The patent extracts and removes the soldering material from the transducer front surface, replacing it with a solderless wire bonding technique. This eliminates the harmful soldering material that was covering a substantial part of the front surface and degrading acoustic pressure output, while still achieving reliable electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

4Reliability

If soldering wires are used for electrical connection, then electrical connection is achieved, but active surface area is reduced

Engineering Contradiction:

Improveelectrical connectionVSAvoidactive surface area

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The patent extracts and removes the excessive soldering material from the transducer front surface, replacing it with a solderless wire bonding technique. This eliminates the harmful effect of solder covering about a quarter of the front side, thereby preserving the active surface area while maintaining electrical connection.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances sensor sensitivity and acoustic pressure output while reducing the space needed for the interconnect, improving the front face of the sensor for acoustic properties and minimizing detrimental acoustic influence.

Implementation Method 1

The interconnect comprises at least a carrier film provided with the metallic layer and/or at least one wire provided with the metallic layer. The interconnect is configured to provide an electrical connection for the sensor element.

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The actuator/receiver for such a device can be based on a circular disk of piezo electric material with electrodes on front and back side.

Methodology Applied

Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS20250040440A1Sensor comprising an interconnect having a carrier film

Publication Date: 2025.01.30 KONINKLIJKE PHILIPS NV

AI summary

The present invention relates to a sensor, comprising a sensor element and an interconnect. The interconnect is configured to be arranged at the sensor element. The interconnect comprises at least a carrier film provided with metallic layer. The interconnect is configured to provide an electrical connection for the sensor element.Furthermore a device comprising the sensor and a method of manufacturing the sensor is provided.