Sensor Metal Lid Recesses for Heat Dissipation

Solution Overview

Problem

The heat dissipation in sensors with metal housings and lids is compromised when laser welding is used, as it damages organic EL displays, and adhesive-based fixation methods fail to efficiently dissipate heat due to lower thermal conductivity.

Innovation Solution

The sensor design incorporates recesses in the edge parts of the metal housing and lid, filled with adhesive, allowing for improved heat transfer from the lid to the housing, reducing heat concentration and enhancing dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If laser welding is used to seal the metal housing and lid, then the sealing strength is improved, but the organic EL display is deteriorated by heat

Engineering Contradiction:

Improvesealing strengthVSAvoidheat damage to organic EL display

Core Design Contradiction:

StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent extracts the adhesive layer from the sealing interface and places it in recesses (grooves) on the housing or lid. This separates the adhesive's bonding function from the sealing function, allowing the adhesive to be contained in specific regions while maintaining overall sealing integrity through the recess structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent applies local quality by providing recesses only in specific regions where adhesive is needed for sealing, rather than using adhesive across the entire interface. This allows selective adhesive placement to achieve sealing strength while minimizing heat-affected areas.

Inventive Principle:

Principle #3Local quality

2Object-affected harmful factors

If adhesive agent is used to fix the metal housing and lid, then the organic EL display is protected from heat, but the heat dissipation is deteriorated due to low thermal conductivity of adhesive

Engineering Contradiction:

Improveheat protection for organic EL displayVSAvoidheat dissipation efficiency

Core Design Contradiction:

Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The patent segments the sealing interface into multiple regions: recesses that contain adhesive for bonding, and non-recess regions that provide direct metal-to-metal thermal conduction paths. This segmentation allows heat to be dissipated through the metal contact areas while adhesive maintains structural bonding in protected regions.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The recess structure acts as an intermediary that guides and concentrates adhesive to specific locations. By confining adhesive to recesses, the patent creates designated bonding zones while leaving other areas open for thermal conduction, effectively mediating between the need for adhesive bonding and the need for heat dissipation.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Strength

If adhesive is applied over the entire overlapping region, then the bonding strength is improved, but the heat concentration on the lid increases

Engineering Contradiction:

Improvebonding strengthVSAvoidheat concentration on lid

Core Design Contradiction:

StrengthVSTemperature

Solution Approach 1:

The patent applies local quality by providing recesses only in specific regions where adhesive is needed for sealing, rather than using adhesive across the entire interface. This allows selective adhesive placement to achieve sealing strength while minimizing heat-affected areas.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent extracts the adhesive layer from the sealing interface and places it in recesses (grooves) on the housing or lid. This separates the adhesive's bonding function from the sealing function, allowing the adhesive to be contained in specific regions while maintaining overall sealing integrity through the recess structure.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design effectively improves heat dissipation in sensors with metal lids adhered to housings, reducing the adverse effects of heat on organic EL displays compared to laser welding and maintaining structural integrity.

Implementation Method 1

the heat generated from the circuit board and transferred to the metal lid is also transferred to the metal housing through the portion at which the edge part and the metal lid come into contact with each other

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11832499B2Sensor

Publication Date: 2023.11.28 OMRON CORP

AI summary

A sensor includes a metal housing and a metal lid. The metal housing houses a circuit board electrically connected to a sensor element and is provided with an opening and an edge part defining the opening. The metal lid is adhered to the edge part to cover the opening. At least one of the edge part and the metal lid is provided with one or more recesses, and the metal lid is adhered to the edge part by a portion of an adhesive agent filled in the recess that is located in a region of an opening end of the recess.