Sensor Device Media Channel Between Substrates

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Solution Overview

Problem

Existing sensor device packaging methods, such as using epoxy sealants, are costly, complex, and prone to failure over time, making it challenging to achieve a small form factor and reliable sensor package.

Innovation Solution

The method involves over-molding a sensor chip and other components between two substrates, with a media channel providing access for sensing and a molding compound that acts as a natural seal and provides mechanical strength, simplifying the manufacturing process and enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If epoxy sealant is used to seal between substrate and plastic lid, then sealing function is achieved, but manufacturing cost increases and process complexity increases

Engineering Contradiction:

Improvesealing reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the epoxy sealant from the packaging structure entirely. Instead of using a separate sealing material applied between substrates, the design integrates sealing functionality into the molding compound itself, which naturally seals around the sensor chip and media channel without requiring additional sealing steps or materials.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The molding compound serves multiple functions simultaneously: it provides mechanical support, protects components, and creates the seal. By combining these functions into a single material and process, the patent eliminates the need for separate sealing operations and reduces overall packaging complexity while maintaining reliable sealing.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If epoxy sealant is used to seal between substrate and plastic lid, then sealing function is achieved, but assembly time increases

Engineering Contradiction:

Improvesealing reliabilityVSAvoidassembly time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent merges the sealing function with the overmolding process. The molding compound is applied in a single continuous operation that simultaneously encases the sensor chip, creates the media channel, and forms the seal against the substrate. This integration eliminates separate sealing steps and reduces total assembly time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The molding compound is designed to naturally seal around components during the overmolding process itself, rather than requiring pre-application of sealant. The sealing action occurs as an inherent part of the molding operation, eliminating the need for preliminary sealing steps before assembly.

Inventive Principle:

Principle #10Preliminary action

3Stress or pressure

If epoxy sealant is used to hold pressure, then pressure containment is achieved, but reliability decreases over time

Engineering Contradiction:

Improvepressure containmentVSAvoidlong-term reliability

Core Design Contradiction:

Stress or pressureVSReliability

Solution Approach 1:

The patent replaces the epoxy sealant, which degrades over time, with a molding compound designed for long-term stability. The molding compound forms a permanent, integrated seal that does not deteriorate like applied sealants, ensuring reliable pressure containment throughout the device's operational lifetime.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The molding compound acts as a composite structural material that provides both mechanical support and sealing functionality. This integrated material solution offers superior long-term reliability compared to separate sealant applications, as it forms a unified structure that resists degradation and maintains pressure containment over time.

Inventive Principle:

Principle #40Composite materials

4Reliability

If sensor chip is mounted on substrate with plastic lid and epoxy sealant, then sensor functionality is achieved, but package size increases

Engineering Contradiction:

Improvesensor reliabilityVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The sensor chip is nested within the molding compound, which is itself attached to the substrate. This nested arrangement allows compact integration of components, eliminating the need for a separate plastic lid and reducing overall package volume while maintaining reliable sensor functionality and protection.

Inventive Principle:

Principle #7Nested doll (Nesting)

Data Source

PatentUS10163660B2Sensor device with media channel between substrates

Publication Date: 2018.12.25 TT ELECTRONICS PLC

AI summary

A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.