Image Sensor Module Sub-Housing Adhesive Alignment for Compact Camera Design
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Solution Overview
Problem
The integration of optical zoom in camera modules for mobile devices often results in increased thickness, leading to reduced bonding space and weakened bonding strength, which compromises durability.
Innovation Solution
The design of an image sensor module with a rectangular image sensor mounted on a substrate, where a sub-housing with specific sidewall orientations and an adhesive are used to reduce the module's size while maintaining durability, and the camera module includes a lens module, housing, and reflection module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If optical zoom is added to camera module, then zoom function is improved, but thickness increases
Solution Approach 1:
The image sensor is mounted on the back surface of the substrate, with the sub-housing nested within the substrate structure. The adhesive protrudes from the sub-housing to fill spaces efficiently, creating a compact nested arrangement that accommodates optical zoom components without increasing overall thickness.
Solution Approach 2:
The image sensor is positioned on the back surface of the substrate rather than on the front, utilizing the thickness dimension differently. This reconfiguration allows optical zoom components to be arranged in a compact footprint on the substrate plane without extending the overall thickness of the camera module.
2Length of stationary object
If thickness is reduced, then camera module size is reduced, but bonding space is reduced
Solution Approach 1:
The adhesive is applied selectively at specific locations where bonding is most critical, such as at the corners or edges of the sub-housing. This localized bonding approach maintains strong adhesion with minimal adhesive volume, preserving camera module size reduction while ensuring adequate bonding space.
Solution Approach 2:
A multi-material construction is employed where the substrate, sub-housing, and adhesive work together as a composite structure. The adhesive material is specifically selected to provide high bonding strength in a thin profile, enabling strong bonds without requiring large bonding areas that would increase overall module size.
3Length of stationary object
If bonding space is reduced, then camera module size is reduced, but bonding strength is weakened
Solution Approach 1:
The adhesive material properties are optimized to achieve high bonding strength in a reduced thickness profile. By changing the material parameters (viscosity, curing characteristics, bond line thickness), strong bonding is achieved without requiring large bonding areas, thus maintaining compact camera module size.
Solution Approach 2:
The adhesive is pre-positioned on the sub-housing or substrate before final assembly, allowing for precise placement in optimal locations. This preliminary positioning ensures maximum bonding effectiveness with minimal adhesive volume, maintaining both compact size and strong bonding.
4Length of stationary object
If camera module size is reduced, then mobile device thickness is reduced, but durability is weakened
Solution Approach 1:
The adhesive protrusion design provides built-in compensation for thermal expansion, mechanical stress, and assembly tolerances. By allowing the adhesive to protrude from the sub-housing in controlled areas, the structure accommodates stress and movement without compromising the compact size or overall durability of the camera module.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for a reduction in the size of the camera module while maintaining durability, preventing an increase in the thickness of the mobile device even with features like optical zoom, auto focusing, and optical image stabilizing.
Implementation Method 1
an adhesive, which bonds the sub-housing and the substrate
Data Source
AI summary
An image sensor module is provided. The image sensor module includes an image sensor which has a rectangular shape having a long side and a short side; a substrate which has a long side corresponding to the long side of the image sensor and a short side corresponding to the short side of the image sensor, wherein the image sensor is mounted on the substrate; a sub-housing installed on the substrate, the sub-housing having a first sidewall disposed on a side corresponding to the long side of the image sensor and a second sidewall disposed on a side corresponding to the short side of the image sensor; and an adhesive which bonds the sub-housing and the substrate, wherein a side surface of the substrate, disposed on the long side of the substrate and an outer surface of the adhesive are disposed on a same plane.