Sensor Module Blade Insert Assembly Process
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing assembly process for sensor modules is complex and time-consuming, involving multiple steps that increase costs and reduce efficiency.
Innovation Solution
A dual gauge lead frame is used, where a semiconductor die and passive devices are attached to a lead frame, encapsulated with a mold compound, and then encased in a sensor housing, bypassing the need for separate packaging and PCB mounting, allowing for a more streamlined assembly process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional multi-step assembly process is used for sensor modules, then reliability and functionality are maintained, but device complexity and manufacturing time increase
Solution Approach 1:
The patent combines multiple separate components (sensor die, passive devices, lead frame, and housing) into a single integrated assembly process. The lead frame serves multiple functions simultaneously as a mechanical support, electrical interconnect, and structural element that eliminates the need for separate PCB mounting, thereby reducing the number of assembly steps while maintaining all necessary functionalities.
Solution Approach 2:
The lead frame is designed as a multi-functional component that provides mechanical support, electrical connectivity, and structural integration. It replaces the need for separate PCB assemblies and mounting hardware, allowing a single component to perform multiple functions that previously required separate parts and assembly steps.
2Manufacturing precision
If separate packaging and PCB mounting steps are performed, then manufacturing precision is maintained, but loss of time increases
Solution Approach 1:
The sensor die and passive devices are pre-assembled and bonded to the lead frame in a single encapsulation process before final housing integration. This preliminary assembly with precise bonding followed by encapsulation maintains manufacturing precision while eliminating subsequent separate mounting operations, thereby reducing total assembly time.
Solution Approach 2:
The patent replaces traditional mechanical PCB mounting operations with a bonded encapsulation process. The mold compound provides both mechanical support and electrical insulation, substituting for separate mechanical mounting steps while maintaining positioning precision through the bonding process.
3Reliability
If multiple assembly steps are used, then reliability is maintained, but productivity decreases
Solution Approach 1:
Multiple assembly operations are merged into a single encapsulation process where the mold compound simultaneously bonds the sensor die and passive devices to the lead frame, provides electrical insulation, and offers environmental protection. This consolidation maintains reliability through proper bonding and protection while significantly improving production efficiency.
Solution Approach 2:
The invention changes the physical state and properties of the mold compound during processing - from liquid or paste form during application to cured solid state after bonding and encapsulation. This parameter change enables a single process step to achieve multiple functions (bonding, insulation, protection) that previously required separate steps, thereby improving productivity while maintaining reliability.
Data Source
AI summary
A sensor module, such as an acceleration sensor module, includes a leaded socket assembly covered by a housing. The leaded socket assembly includes a dual gauge lead frame, a sensor die, and various passive devices. The sensor die and the passive devices are mounted on the lead frame, and then the lead frame, sensor die, and passive devices are over-molded to form the leaded socket assembly. Neither the sensor module nor the socket assembly includes a printed circuit board, so many conventional sensor module assembly steps are bypassed.