Image Sensor Module Ceramic Substrate Venting
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Solution Overview
Problem
Image sensor modules face electrical connection issues due to increased air pressure caused by gas generation from conductive glue during heating, leading to poor contact between the ceramic substrate and the circuit board module.
Innovation Solution
The camera module design incorporates a flexible printed circuit board with a stiffening plate and an anisotropic conductive film, which is hot-pressed to ensure electrical connectivity while maintaining air holes to prevent pressure buildup, and uses an opaque glue filling body to secure the image sensor within a recessed area on the ceramic substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive glue is used to electrically connect the ceramic substrate to the circuit board module, then electrical connection is achieved, but gas is generated during heating causing air pressure increase and poor electrical connection
Solution Approach 1:
The patent extracts and removes the harmful gas generated by the conductive glue through a vent hole in the ceramic substrate. This allows the gas to escape rather than accumulating and causing pressure buildup that would degrade electrical connection reliability.
Solution Approach 2:
The vent hole acts as an intermediary pathway that allows the harmful gas to be channeled away from the electrical connection interface. This mediator structure prevents the gas from directly interfering with the conductive glue's electrical connection function.
2Temperature
If the ceramic substrate is heated during testing, then thermal stress is applied, but the conductive glue generates gas causing air pressure increase and forcing the ceramic substrate away from the circuit board module
Solution Approach 1:
The vent hole extracts and removes the gas generated during heating, preventing pressure buildup that would force the ceramic substrate away from the circuit board module. This maintains proper contact under thermal stress conditions.
Solution Approach 2:
The heating process that generates harmful gas is converted into a beneficial testing condition by providing a controlled pathway for gas escape. The vent hole transforms the harmful pressure buildup effect into a manageable gas flow that actually verifies the connection's thermal stability.
3Reliability
If anisotropic conductive film is hot-pressed to ensure electrical connectivity, then electrical connection is improved, but air holes must be maintained to prevent pressure buildup
Solution Approach 1:
The ceramic substrate serves multiple functions: it provides mechanical support, creates the sealed cavity for the opaque glue, and incorporates the vent hole for gas escape. This multi-functionality reduces the need for additional separate components, simplifying the overall structure despite the multiple materials used.
Solution Approach 2:
The patent uses composite material structures, including the combination of the rigid ceramic substrate with the flexible opaque glue and the anisotropic conductive film. This composite approach allows each material to contribute its specific properties while working together to solve both electrical connectivity and pressure management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances mechanical strength and maintains reliable electrical connections by preventing air pressure increase and ensuring consistent contact between the image sensor and circuit board, even under thermal stress.
Implementation Method 1
The anisotropic conductive film is adhered on the first surface 111 of the FPCB 11. The anisotropic conductive film is electrically connected to the FPCB 11 along a direction perpendicular to the first surface 111 and is electrically disconnected to the FPCB 11 along a direction parallel with the first surface 111 when the anisotropic conductive film is subjected to a hot pressing process.
Data Source
AI summary
An image sensor module includes a ceramic substrate, an image sensor, a conductive film, and a bottom plate. The ceramic substrate includes an upper surface, a lower surface opposite to the upper surface, a side surface connected between the upper surface and the lower surface. The ceramic substrate has a through hole through the upper and lower surfaces, a receiving recess on the lower surface, and an air hole on the side surface. The through hole communicates with the receiving recess, and the air hole communicates with the receiving recess. The image sensor is received in the receiving recess and is electrically connected to the ceramic substrate. The bottom plate is positioned on the lower surface and electrically connected to the ceramic substrate by the conductive film.