Sensor Module Dual-Orientation Design for Pressure Sensing
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Solution Overview
Problem
Existing sensor modules for pressure sensors lack flexibility and media robustness, as they are typically mounted in a fixed orientation and can be prone to liquid accumulation and icing, limiting their application range and increasing manufacturing costs due to the need for multiple molds.
Innovation Solution
A sensor module design that allows for installation and electrical connection in both orientations, with a monolithic module base and wall, straight connection elements, and optional gel-side openings for differential pressure measurement, enabling flexible application and reduced risk of liquid accumulation through a single mold design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the sensor module is designed with a fixed mounting orientation, then the manufacturing process is simplified, but the application flexibility and media robustness are reduced
Solution Approach 1:
The connection elements are designed with asymmetric exposure patterns - different sets of connection elements are exposed on opposite sides of the module wall. This asymmetric design allows the module to be mounted in either orientation (gel side up or down) while ensuring proper electrical connections, thereby improving application flexibility without requiring symmetric design modifications
Solution Approach 2:
The module base is designed with a universal chip mounting area that can accommodate pressure sensor chips regardless of mounting orientation. The standardized connection element arrangement and exposure pattern enable the same module design to serve multiple applications and mounting configurations, achieving multi-functionality and reducing the need for multiple specialized molds
2Reliability
If the sensor module allows installation in both orientations, then the media robustness is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The connection elements are pre-positioned and fixed in the module wall during manufacturing, with predetermined exposure patterns on both sides. This preliminary positioning ensures that regardless of mounting orientation, the connection elements will align properly with the sensor housing contacts, reducing manufacturing precision requirements during assembly
Solution Approach 2:
Different sections of the module wall have different connection element exposure patterns - one side has connection elements exposed for upward mounting, while the opposite side has connection elements exposed for downward mounting. This local differentiation allows the module to adapt to different orientations without requiring high precision manufacturing across the entire structure
3Ease of operation
If connection elements are exposed for dual-orientation installation, then the ease of operation is improved, but the risk of electrical interference increases
Solution Approach 1:
The module wall acts as an intermediary barrier that physically isolates connection elements exposed on opposite sides. When the module is mounted in a specific orientation, only the connection elements on that side are exposed and accessible, while connection elements on the opposite side remain protected by the module wall, preventing electrical interference while maintaining installation convenience
Data Source
Figure 1a~1b
Figure 1c~1d
Figure 2
AI summary
The invention relates to a sensor module (101; 201; 301; 401) for receiving a pressure sensing chip (104, 122; 204) and for assembling in a sensor housing (102, 117; 202, 217). The sensor module is used to receive a pressure sensing chip, a module wall (105) which is monolithically connected to the module base and which surrounds the pressure sensing chip being provided. Multiple connecting elements (106; 206; 306; 406) that are fed through the module wall towards the outside run in a straight line at least in the entire outer region. Furthermore, the connecting elements are exposed on the upper and lower connecting element face at least in some regions in order to apply and electrically connect at least one electric component (113; 213; 313; 413) and to electrically integrate the sensor module into the sensor housing. In this manner, a sensor module with an identical outer geometry and identical connections can be used on both sides dependent on the type of sensor in which the sensor module is used.