Image Sensor Module with Embedded Signal Processor
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Solution Overview
Problem
Conventional image sensor modules are bulky due to the placement of the image signal processor on the bottom surface of the substrate, leading to overheating, reduced efficiency, and potential damage to electrical connections, which restricts their use in portable electronic devices.
Innovation Solution
The image signal processor is placed in a concave on the substrate, with a supporting board and heat sink to reduce module thickness and facilitate heat dissipation through vent holes, ensuring efficient cooling and protection of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the image signal processor is disposed on the bottom surface of the substrate in the form of a module, then the electrical connection between the image signal processor and the substrate is maintained, but the image sensor module has a larger thickness
Solution Approach 1:
The image signal processor is embedded within a concave portion of the substrate, creating a nested structure where the processor fits into the recessed area. This nesting approach allows the processor to be integrated into the substrate structure without adding to the overall thickness of the module, effectively resolving the contradiction between maintaining electrical connection and reducing module thickness.
Solution Approach 2:
Instead of placing the image signal processor on the flat bottom surface of the substrate (two-dimensional arrangement), the invention utilizes the vertical dimension by creating a concave portion in the substrate. This dimensional change allows the processor to be positioned in a recessed area, reducing the module's overall thickness while maintaining proper electrical connections through wire bonding.
2Temperature
If the image sensor chip is stacked on the image signal processor via a spacer, then the electrical connection is maintained, but overheat of the image sensor chip and the image signal processor may easily occur
Solution Approach 1:
The invention extracts the image signal processor from the stacked arrangement with the image sensor chip and places it in a concave portion of the substrate. This separation removes the processor from direct thermal contact with the chip, extracting the heat source from the immediate vicinity of the chip and reducing overheating issues while maintaining electrical connections through the substrate.
Solution Approach 2:
The substrate acts as an intermediary structure between the image sensor chip and the image signal processor. By placing the processor in a concave portion of the substrate rather than stacking it directly on the chip, the substrate mediates the thermal interaction, providing thermal isolation while maintaining electrical connectivity through wire bonding connections.
3Reliability
If the actuator is assembled on the substrate, then the image self-focusing operation is achieved, but the actuator may easily squeeze and damage the wire connected between the image signal processor and the substrate
Solution Approach 1:
The image signal processor is nested within a concave portion of the substrate, and the wire connections are routed within this protected recessed area. This nesting structure provides physical protection for the delicate wire connections, shielding them from external forces applied by the actuator during image self-focusing operations, thereby maintaining reliable electrical signal transmission.
Solution Approach 2:
The concave portion of the substrate serves as a protective structure that cushions and protects the wire connections between the image signal processor and the substrate. By pre-positioning the processor in this recessed area, the structure provides beforehand protection against potential damage from external forces, ensuring the wires remain undamaged during actuator operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design results in a slimmer, more efficient image sensor module with improved heat dissipation, reduced risk of overheating, and enhanced durability, making it suitable for portable electronic devices.
Implementation Method 1
heat dissipation through vent holes, ensuring efficient cooling
Implementation Method 2
supporting board and heat sink to reduce module thickness and facilitate heat dissipation
Data Source
AI summary
An image sensor module including a substrate, an image signal processor, a supporting board, an image sensor chip and a cover is provided. A concavity is located on a surface of the substrate. The image signal processor is disposed in the concavity e, and is electrically connected to the substrate. The supporting board is disposed on the surface of the substrate and covers the concavity. The image sensor chip is disposed on the supporting board and electrically connected to the substrate. The cover is disposed on the substrate, and covers the image sensor chip.