Sensor Module with Selective Sensing Region Exposure
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Solution Overview
Problem
Semiconductor chip-based sensors require exposure to the environment to detect physical parameters, but integrated circuit chips are typically fully encapsulated, posing a challenge in manufacturing sensor modules that balance miniaturization and environmental access while maintaining functionality.
Innovation Solution
The method involves placing semiconductor sensors on a carrier with a sensing region exposed and using a sealing material and protruding structures to prevent moulding material from covering the sensing region, while allowing environmental access and electrical connectivity through conductive sealing and moulding materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If semiconductor sensors are integrated onto a carrier with full encapsulation, then mechanical and chemical protection is improved, but environmental access for sensing is worsened
Solution Approach 1:
The patent applies local quality by creating a selective opening in the encapsulation structure. The carrier is encapsulated with moulding material to provide overall protection, but a specific region is left open to expose the sensing area of the semiconductor sensor to the environment. This allows the majority of the device to be protected while the sensing region maintains environmental access for detecting physical parameters.
2Measurement precision
If the sensing region is exposed to the environment, then sensitivity for parameter detection is improved, but susceptibility to harmful environmental factors is worsened
Solution Approach 1:
The patent employs a thin film or membrane structure as part of the carrier or encapsulation layer that selectively covers the sensing region. This thin film allows physical parameters (such as pressure, temperature, or chemical substances) to interact with the sensor while providing a protective barrier against harmful environmental factors. The film is designed to be permeable or transparent to the target sensing parameters while blocking contaminants.
3Volume of moving object
If semiconductor chip-based sensors are miniaturized, then integration density is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the semiconductor sensor, carrier, and encapsulation structure into an integrated assembly. The sensor is mounted directly onto the carrier, which itself is designed with the encapsulation features and sensing openings. This integration eliminates the need for separate assembly steps for mounting and encapsulating, simplifying the manufacturing process despite the miniaturized scale of the components.
Data Source
AI summary
The embodiments herein relate to sensor modules having sensor chips with a sensing region on a face thereof, and methods for their manufacture.