Sensor Module Extrusion Coating for Precision Mounting
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Solution Overview
Problem
Conventional sensor module production methods can damage sensor elements due to injection molding forces and heat, affecting their accuracy, and require complex joining techniques and costly circuit boards.
Innovation Solution
The sensor element is fixed to the line part after extrusion coating with plastic, allowing for a single-stage injection process and force- or form-fitting attachment, eliminating the need for soldering or bonding and reducing the complexity of the housing design, while using two-core interfaces for sensor contact and a hermetically sealed housing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sensor element is fitted to the line part before extrusion coating with plastic material, then the injection molding process can be carried out, but the sensor characteristics are adversely affected by injection-molding forces and heat
Solution Approach 1:
The sensor element is pre-mounted on the line part in a first production step, and then the housing is produced in a second production step by extrusion coating the line part with plastic material. This preliminary mounting allows the sensor to be positioned before the molding process, while the housing formation is completed subsequently without exposing the sensor to damaging forces and heat.
Solution Approach 2:
The production process is divided into two separate steps: first mounting the sensor element on the line part, then separately forming the housing through extrusion coating. This segmentation isolates the sensor mounting process from the high-stress injection molding process, preventing damage to the sensor while maintaining integration.
2Reliability
If complex joining techniques such as soldering or bonding are used to fix the sensor element, then reliable electrical connection is achieved, but the mounting process becomes complicated and time-consuming
Solution Approach 1:
The patent replaces complex electrical joining techniques (soldering, bonding) with a simple mechanical insertion method. The sensor element is inserted into a receiving region of the line part where it makes direct electrical contact through conductive contacts, eliminating the need for thermal or chemical joining processes while maintaining reliable electrical connection.
Solution Approach 2:
The line part is designed with integrated receiving regions and contacts that automatically establish electrical connection when the sensor element is inserted. The sensor element itself serves as the connecting element, utilizing its own structure to make contact with the line part's contacts, thereby eliminating the need for separate joining operations.
3Adaptability or versatility
If separate substrate elements are used for mounting sensors, then vectorial quantities can be measured, but the device complexity increases with multiple components and perpendicular placement
Solution Approach 1:
The patent combines multiple substrate functions into a single line part structure. The line part integrates multiple receiving regions for mounting different sensor elements (including perpendicular arrangements for vectorial measurement) and incorporates electrical contacts and housing integration features, thereby achieving versatile measurement capability while reducing the number of separate components.
Solution Approach 2:
The line part is designed as a universal mounting structure that can accommodate different types of sensor elements in various orientations (including perpendicular placements for measuring vectorial quantities). It provides integrated electrical contacts, mechanical support, and housing integration features, making it a multi-functional component that replaces multiple separate substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances sensor accuracy, simplifies the mounting process, reduces costs by eliminating the need for circuit boards, and provides a cost-effective, reliable sensor module with improved durability and ease of assembly.
Implementation Method 1
the sensor element is fixed in place on the line part in particular only in force-fitting and/or form-fitting manner
Implementation Method 2
the sensor element is fixed in place on the line part in particular only in force-fitting and/or form-fitting manner
Implementation Method 3
a single-stage injection process suffices
Implementation Method 4
the line part has been extrusion-coated with the plastic material in order to produce the housing
Implementation Method 5
The line part is electrically conductive and preferably includes a metallic line part, so that the sensor element is able to be contacted from outside the housing via the line part
Implementation Method 6
a sensor for measuring a magnetic field (e.g., a Hall-effect sensor)
Data Source
AI summary
A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.