Photo Sensor Module Package With Recessed Glass Filter Alignment
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Solution Overview
Problem
Conventional light sensor modules face issues with mechanical damage and alignment challenges due to the direct placement of glass filters on the sensing surface, which affects the detection of specific light spectra and illumination efficiency.
Innovation Solution
The image module package employs an over-molding or casting process to create a sub-assembly with a transparent layer and a receptacle for the glass filter, eliminating direct contact and improving alignment, while also incorporating a light guiding structure to enhance illumination efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a glass filter is directly disposed on the sensing surface, then the alignment problem is improved, but the sensing surface can be damaged
Solution Approach 1:
The patent introduces a transparent adhesive layer as an intermediary between the glass filter and the sensing surface. This adhesive layer serves as a mediator that both secures the glass filter in proper alignment and prevents direct mechanical contact that would cause damage to the sensing surface, thereby resolving the contradiction between alignment precision and mechanical damage prevention
2Reliability
If a glass filter is directly disposed on the sensing surface, then the filtering function is improved, but the sensing surface can be damaged
Solution Approach 1:
The transparent adhesive layer acts as a protective intermediary that maintains the filtering function of the glass filter while preventing mechanical damage to the sensing surface. The adhesive provides both structural support for the filter and mechanical isolation from the sensitive sensing surface
3Illumination intensity
If transparent layers are separated, then the illumination efficiency is improved, but the device complexity is increased
Solution Approach 1:
The patent segments the transparent layers into separate components: a first transparent layer covering the sensing surface and a second transparent layer covering the light source. This segmentation allows each layer to be optimized independently for illumination efficiency while the overall structure remains manageable through modular design
4Ease of manufacture
If an over-molding or casting process is used, then the manufacturing process is simplified, but the device complexity is increased
Solution Approach 1:
The patent merges multiple manufacturing steps into a single over-molding or casting process that simultaneously forms the transparent layers, receptacles, and adhesive bonding in one operation. This consolidation simplifies the overall manufacturing process despite the increased complexity of the molded structure, as it eliminates multiple separate assembly steps
Data Source
AI summary
There is provided a module package including a substrate, a photo sensor chip, a molded transparent layer and a glass filter. The substrate has an upper surface. The photo sensor chip is attached to the upper surface of the substrate and electrically connected to the substrate. The molded transparent layer covers the photo sensor chip and a part of the upper surface of the substrate, wherein a top surface of the molded transparent layer is formed with a receptacle opposite to the photo sensor chip. The glass filter is accommodated in the receptacle.