Sensor Module Flexible Substrate Thermal Path Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing sensor modules face challenges in achieving accurate and sensitive parameter measurement due to heat interference from electronic circuitry, which is exacerbated by compact packaging that limits optimal sensor placement and thermal insulation.
Innovation Solution
A sensor module with a flexible substrate that increases the thermal path between the sensing element and electronic circuitry, combined with a structural package that provides mechanical protection and additional thermal insulation, allowing the sensing element to be positioned directly at the measurement location with minimal heat influence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the sensor package is made compact to reduce footprint and installation complexity, then the device size and installation ease are improved, but the sensing accuracy deteriorates due to increased thermal interference from electronic components
Solution Approach 1:
The patent introduces a thermal barrier as an intermediary element positioned between the sensing element and electronic components. This thermal barrier acts as a mediator that blocks heat transfer from the electronic components to the sensing element, thereby maintaining sensing accuracy even in compact device configurations where the physical distance between components is reduced.
2Measurement precision
If the sensing element is positioned closer to the measurement location to improve sensing accuracy, then the measurement precision is improved, but the thermal interference from electronic components worsens due to limited space for thermal insulation
Solution Approach 1:
The thermal barrier serves as a protective intermediary that enables the sensing element to be positioned close to the measurement location while still protecting it from thermal interference. The barrier material blocks heat pathways, allowing the sensing element to operate in thermally hostile environments near electronic components without compromising measurement accuracy.
3Object-affected harmful factors
If the distance between the sensing element and electronic components is increased to reduce thermal interference, then the thermal insulation is improved, but the device complexity and installation difficulty worsen due to larger package size requirements
Solution Approach 1:
The patent employs a thin-film thermal barrier that provides effective thermal insulation without requiring large distances between components. This flexible thin film structure achieves thermal isolation in a compact form factor, avoiding the need for complex packaging or large device volumes while still protecting the sensing element from thermal interference.
4Shape
If the sensing element is embedded in an insulated surface to provide concealment and reduce obstructions, then the aesthetic appearance and space utilization are improved, but the heat evacuation capability deteriorates causing thermal accumulation at the sensing element
Solution Approach 1:
The patent segments the device into distinct functional zones: a front portion where the sensing element is embedded in the insulated surface for concealment and aesthetic purposes, and a rear portion that provides thermal management. This segmentation allows the sensing element to be hidden while heat from electronic components is evacuated through dedicated thermal pathways in the rear, preventing thermal accumulation at the sensing location.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances measurement sensitivity and accuracy by effectively isolating the sensing element from heat-generating components, while maintaining compact packaging and facilitating secure, direct sensing without compromising mechanical protection or installation complexity.
Implementation Method 1
The flexible substrate is adapted to increase the length of a thermal path between the sensing element and the electronic circuitry
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A sensor module includes at least one sensing element for providing a signal as a response to a measurement of a parameter from a location, and electronic circuitry for processing said signal. The sensor module further comprises a flexible substrate comprising the at least one sensing element; the flexible substrate is adapted to increase the length of a thermal path between the sensing element and the electronic circuitry. The sensor module may be included in a sensor package, forming a package sensor, which includes holding means for holding the at least one sensing element in a sensing zone so the location parameter can be directly sensed by the sensing element. A sensor package is further described, including said holding means.