Image Sensor Module Housing with Embedded Wiring
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Solution Overview
Problem
Conventional methods for connecting electric components to lenses in image sensor modules, such as multi-layer wire bonding and via interconnection, face challenges in miniaturization, increased fabrication costs, and reduced productivity, limiting the development of high-resolution image sensor modules with advanced optical features.
Innovation Solution
An image sensor module design featuring a sensor chip, lenses, and electric components housed within a structure with anisotropic conducting film (ACF) patches and elongated plate-type spring connecting terminals, allowing for compact integration and electrical connection without increasing module size or cost, using a flexible printed circuit board and surface mounting technology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multi-layer wire bonding method is used to connect electric component to PCB, then electrical connection is achieved, but module size increases and fabrication cost increases
Solution Approach 1:
The patent extracts the wiring function from the traditional multi-layer wire bonding method and relocates it to the housing structure. The housing itself becomes the wiring carrier with conducting wires embedded in its walls, eliminating the need for separate wire bonding processes and reducing module size.
Solution Approach 2:
The housing acts as an intermediary structure that simultaneously provides mechanical support and electrical connection functions. By embedding conducting wires in the housing walls, the housing mediates between the electric component and the PCB, eliminating the need for separate wire bonding infrastructure.
2Reliability
If multi-layer wire bonding method is used to connect electric component to PCB, then electrical connection is achieved, but fabrication cost increases
Solution Approach 1:
The patent merges the housing structure with the wiring function into a single integrated component. The conducting wires are embedded directly in the housing walls during housing fabrication, combining structural manufacturing with electrical connection establishment, thereby reducing overall fabrication cost.
Solution Approach 2:
The housing serves multiple functions simultaneously: mechanical support, light shielding, and electrical connection. This multi-functionality eliminates the need for separate wire bonding processes and components, reducing fabrication complexity and cost.
3Reliability
If via interconnection method is used to form via holes in glass substrates, then electrical connection is achieved, but fabrication process becomes complicated and productivity decreases
Solution Approach 1:
The patent extracts the electrical connection function from the complex via interconnection process in glass substrates and relocates it to the housing structure. This eliminates the need for forming via holes through multiple glass layers, significantly simplifying the fabrication process.
Solution Approach 2:
The patent replaces the complex mechanical via hole formation process with a simpler embedding process where conducting wires are placed in grooves or cavities of the housing. This substitution eliminates the need for drilling, plating, and filling operations required in via interconnection methods.
4Adaptability or versatility
If electric component is mounted to lenses to adjust optical characteristics, then optical functionality is improved, but module size increases
Solution Approach 1:
The housing serves multiple functions simultaneously: mechanical support for lenses and electric components, light shielding, and electrical connection through embedded conducting wires. This multi-functionality allows electric components to be mounted on lenses without requiring additional space for separate wiring infrastructure.
Solution Approach 2:
The patent implements a nested structure where electric components are mounted on lenses, which are in turn mounted on the sensor chip within the housing. The conducting wires are embedded within the housing walls, creating a compact nested arrangement that minimizes overall module size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the integration of electric components to adjust optical characteristics without enlarging the module, reducing fabrication costs, and enhancing productivity while maintaining high-resolution capabilities.
Implementation Method 1
an anisotropic conducting film (ACF) patch electrically connecting the first connecting terminal to the terminal pad of the sensor chip
Implementation Method 2
a second connecting terminal connected to the terminal pad of the electric component, formed of an elongated plate type spring elastically contractible
Data Source
AI summary
An image sensor module capable of facilitating an electrical and mechanical connection of an electric component and a fabrication thereof are disclosed. The image sensor module includes a sensor chip; at least one lens disposed above the sensor chip; at least one electric component disposed with respect to the at least one lens to adjust optical characteristics of the at least one lens; a housing accommodating and closing up the sensor chip, the at least one lens and the at least one electric component, and having an opening to expose the at least one lens to an outside thereof; and a wiring part longitudinally disposed on an inner surface of the housing, and including at least one conducting wire having a first connecting terminal exposed to the outside of the housing to allow the at least one conducting wire to electrically connect a terminal pad of the at least one electric component with an external electronic device and a second connecting terminal connected to the terminal pad of the at least one electric component.