Integral Molded Sensor Module Terminal Arrangement
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Solution Overview
Problem
Conventional pressure sensor apparatuses require an adhesive fixing process, increasing manufacturing costs, and are inflexible in rearranging the order of external terminal functions without producing multiple types of sensor modules.
Innovation Solution
The sensor module and connector connecting portion are molded integrally using an insulating resin, eliminating the need for adhesive fixing and allowing the order of external terminal functions to be modified by selecting internal terminals, thereby reducing manufacturing costs and enabling standardization and shared use of parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sensor module is adhesively fixed to the upper case, then the sensor module is securely mounted, but the manufacturing cost increases due to the additional adhesive fixing process
Solution Approach 1:
The sensor module and connector connecting portion are integrated into a single molded structure, combining two previously separate components (sensor module and upper case) into one integral unit. This eliminates the adhesive fixing process while maintaining secure mounting, thereby reducing manufacturing costs.
2Adaptability or versatility
If the order of external terminals is changed to modify function arrangement, then design flexibility improves, but multiple types of sensor modules must be prepared increasing complexity
Solution Approach 1:
A single standardized sensor module design is used with fixed internal terminal arrangements. The connector connecting portion is designed to accommodate different terminal arrangements through flexible wiring configurations, allowing one sensor module type to serve multiple terminal arrangement requirements.
Data Source
AI summary
The sensor module has four internal terminals that include a first ground terminal, a second ground terminal, an output signal terminal, and a power terminal, three external terminals are connected to the first ground terminal, the output signal terminal, and the power terminal, respectively, a sensor main body portion is obtained by molding the sensor module to which the external terminals are connected integrally in a insulating resin, and a connector connecting portion and a mount portion are molded integrally with the sensor module in this sensor main body portion. With this system, different orders of arrangement of the three external terminals may be formed while insuring that capacitors may be mounted between certain terminals without spanning other wiring patterns.